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Thickness is a really critical factor because plain strain and plain stress conditions are valid for thick and thin films, respectively. Three dimensional stress tensors in plain strain result in development of significant strain through thickness. To release the strain, film starts to delaminate from the wafers. Õâ¶Î»°µÄÒâ˼²»Ì«Åª¶®£¬ºñµÄÕ³½á²ãºÍ±¡µÄÕ³½á²ã °þÀëÆðÀ´ÓÐÊ²Ã´Çø±ðÄØ£¿£¿ÄÇôµ½µ×¶àºñÊÇ·Ö½çÏßÄØ£¿ ![]() ![]() ![]() |
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