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[资源] CMP 化学机械抛光

非常详细的化学机械抛光。最新著作

Contents
List of contributors xi
Woodhead Publishing Series in Electronic and Optical Materials xiii
Introduction xix
Part One CMP of dielectric and metal films 1
1 Chemical and physical mechanisms of dielectric chemical mechanical
polishing (CMP) 3
Y. Moon
1.1 Introduction 3
1.2 History of dielectric CMP 3
1.3 Material removal mechanism of dielectric CMP 4
1.4 Defectivity of dielectric CMP 11
1.5 Major applications of dielectric CMP 16
1.6 Future of dielectric CMP 24
References 25
2 Copper chemical mechanical planarization (Cu CMP) challenges
in 22 nm back-end-of-line (BEOL) and beyond 27
M. Krishnan, M.F. Lofaro
2.1 Introduction 27
2.2 Factors that affect Cu CMP at the 22 nm node and beyond 28
2.3 Conclusions 42
Acknowledgments 42
References 43
3 Electrochemical techniques and their applications for chemical
mechanical planarization (CMP) of metal films 47
D. Roy
3.1 Introduction 47
3.2 Chemical component of metal CMP 48
3.3 Electrochemical basis of metal CMP 51
3.4 Experimental considerations 59
3.5 Illustrative applications 64
3.6 Conclusions 82
Acknowledgments 83

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附件 1 : Advances_in_Chemical_Mechanical_Planarization_(CMP).pdf

2016-03-06 20:10:25, 22.12 M