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无铅焊料互连技术基础:从微观结构到可靠性（2015英文版）
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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniqueExplores emerging technologies in lead-free soldering Table of contents : Content: Front Matter....Pages i-xiii Introduction....Pages 1-20 Interconnection: The Joint....Pages 21-50 Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys....Pages 51-80 Microstructure Development: Solidification and Isothermal Aging....Pages 81-112 Thermal Cycling Performance....Pages 113-168 Mechanical Stability and Performance....Pages 169-210 Chemical and Environmental Attack....Pages 211-230 Challenges in Future-Generation Interconnects: Microstructure Again....Pages 231-249 Back Matter....Pages 251-253 |
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2015-03-03 16:42:18, 15.15 M
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