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[求助]
汉译英 求润色，谢谢。
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本文采用等离子喷涂和电沉积两种工艺在Fe基体上沉积Zn涂层，研究了界面微观阻尼和涂层厚度对阻尼性能和动态模量的影响，并对电沉积Zn/Fe涂层系统进行了热处理，进一步研究了元素扩散对阻尼性能的影响。结果表明：系统阻尼值的大小与厚度比的关系不大。等离子涂层系统的缺陷率越大时，阻尼峰值越大，阻尼峰值与缺陷率可用关系式QP = 1.5+ 5.0/ (1+(D/0.2)5)表示，而动态模量则随着缺陷率的增加有逐渐降低的趋势。 In this paper, the Zn coatings were prepared onto the Fe substrate by air plasma spray process and electro-deposition technology respectively, and the effect of interfacial microstructure and coating thickness on the damping and dynamic modulus was studied, and electro-deposited Zn/Fe coating system was heated treatment, the effects of element diffusion on damping properties was further studied. The results indicated that: the effect of thickness ratio on system damping was small. The lager defect rate of plasma spray was corresponding to the greater damping-peak (with fitted line of QP = 1.5 + 5.0 / (1 + (D/0.2) 5)), while the dynamic modulus gradually decreased with the increasing defect rate. |
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3楼2014-07-16 13:51:58
【答案】应助回帖
★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★
RXMCDM: 金币+1, 多谢应助！ 2014-07-16 14:39:02
wxqtjw: 金币+15, ★★★很有帮助 2014-07-17 11:00:54
wxqtjw: 金币+15, 翻译EPI+1 2014-07-17 13:57:25
RXMCDM: 金币+1, 多谢应助！ 2014-07-16 14:39:02
wxqtjw: 金币+15, ★★★很有帮助 2014-07-17 11:00:54
wxqtjw: 金币+15, 翻译EPI+1 2014-07-17 13:57:25
In this paper, plasma spraying and electrodeposited were applied to make nickel coating be deposited on a copper substrate,the effects of interfacial microstructure damping and the coating thickness on damping properties and dynamic modulus have been studied,in addition to,Electrodeposited Ni / Cu coating system has been heated to research the effects of element diffusion on damping performance.The results have showed that the relationship of the system damping values and thickness ratio was unobvious.When the defect rate of plasma coating system is higer,the greater damping peak values will appear.The relationship formula of damping peak value and defect rate is QP = 1.5+ 5.0/ (1+(D/0.2)5),meanwhile the gradually decreasing trend of dynamic modulus has been found when the defect rate is increasing. |
2楼2014-07-16 13:50:52
