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MENS 和 NEMS 领域内期刊总结与点评，助大家找准期刊，顺利发表，欢迎各位踊跃留言
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MEMS-related Glossary （希望有所帮助） A ADC Analog-to-Digital Converter AES Auger Electron Spectroscopy AGC Automatic Gain Control ASIC Application-Specific Integrated Circuit ATM Asynchronous Transfer Mode; also, Atmosphere (1 ATM = 760 mmHg) Alias A false lower frequency component that appears in sampled data acquired at too low sampling rate. Aluminum A conductive metal used in wafer fabrication to connect the various parts of the circuit. Analog-to-Digital Converter (ADC or A/D) An electronic device, often an integrated circuit, that converts an analog voltage to a digital number. Anodic Bonding A method of hermetically and permanently joining glass to silicon without the use of adhesives. The silicon and glass wafers are heated to a temperature (typically in the range 300-500oC depending on the glass type) at which the alkali-metal ions in the glass become mobile. The components are brought into contact and a high voltage applied across them. This causes the alkali cations to migrate from the interface resulting in a depletion layer with high electric field strength. The resulting electrostatic attraction brings the silicon and glass into intimate contact. Further current flow of the oxygen anions from the glass to the silicon results in an anodic reaction at the interface and the result is that the glass becomes bonded to the silicon with a permanent chemical bond. Application-Specific Integrated Circuit (ASIC) A proprietary semiconductor component designed and manufactured to perform a set of specific functions for a specific application. Argon An inert gas typically used in deposition systems. Arsenic A chemical element typically used as an N-type dopant in various doping, deposition, and ion implant processes. Aspect Ratio Lateral - the ratio of the length of a structure in the plane of the wafer to its width in that plane. Vertical - the ratio of the height of a structure perpendicular to the wafer's surface to its depth in the wafer's plane. B Behavioral Model A high-level representation of an electronic design that describes the behavior of various modules or subsystems in the design, usually without regard to the underlying technology used to implement the design. BOE Buffered oxide etch BioMEMS MEMS systems with applications for the biological and/or chemical segments Bipolar A signal range that includes both positive and negative values (for example, -5 V to +5 V). Bipolar Process Bipolar devices are semiconductor devices in which both electrons and holes participate in the conduction process. In a typical bipolar transistor, silicon serves as a substrate and two closely coupled p-n junctions serve as contacts. Bluetooth A code name for an open specification to standardize data synchronization between disparate PC and handheld PC devices. Research is underway in RF-MEMS devices for Bluetooth-based applications. Bonding The process by which one type of substrate is attached to the surface of another. Bonding Aligners A tool which first precisely aligns patterns on two (or more) substrates, typically followed by bonding of the substrates while the patterns remain aligned. Bonding Pads A pad placed around the perimeter of the chip, which will be used to attach the chip to the package leads. Boron An element used as a P-type dopant in crystal growing and in various fabrication processes Bulk Technology Technology based on the manipulation of atoms and molecules in bulk, rather than individually. Bus A group of conductors that interconnect individual circuitry in a computer or digital device with which data transferred between various components of the device. Typically, a bus is the expansion mechanism to which I/O or other devices are connected. Example of PC buses are the AT bus, NuBus, and EISA bus. C CAE Computer-Aided Engineering CAM Computer-Aided Manufacturing CCD Charge-Coupled Device CDMA Code Division Multiple Access. Also called Spread Spectrum. A type of digital cellular phone service. CIF Caltech Intermediate Format, a common output format of designs drawn using a CAD program. These drawing eventually become masks used in photolithography. CMOS Complementary Metal-Oxide Semiconductor. A type of integrated circuit fabrication process. CNC Computerized Numerical Control CVD Chemical Vapor Deposition Cassette Vessel with slots used to hold wafers for cleaning, transporting or processing through the fabrication processes Chemical Mechanical Planarization (CMP) The use of a compound to polish a wafer's surface to eliminate topological layer effects in the manufacturing of semiconductors. Cladding The material surrounding the core of an optical fiber. The cladding has a lower refractive index (faster speed) in order to keep the light in the core. The cladding and the core make up an optical waveguide. Cold-Junction Compensation A method of compensating for inaccuracies in thermocouple circuits. Comb Drive A MEMS device consisting of inter-digitated fingers similar to a comb. Primary applications – inertial sensors and RF resonators. Common-Mode Range The input range over which a circuit can handle a common mode signal. Common-Mode Rejection Ratio (CMRR) A measure of an instrument's ability to reject interference from a common mode signal, usually expressed in decibels (dB). Common-Mode Signal The mathematical average voltage, relative to the device's ground, of the signals from a differential input. Conductor A material which can conduct or pass electrical current. Core The central region of an optical fiber through which light is transmitted. It has a refractive index different than the surrounding cladding. D DEMA Distributed Electromechanical Actuator DIP Dual In-line Package DP Differential Pressure Develop 3rd step in the photolithography process, during which chemicals are applied on coated and aligned wafers to remove areas of exposed photo resist, leaving the wafer with a photo resist pattern. Die Chip cut from a larger wafer before it is packaged. Dielectric A material typically used as an insulator that contains few (if any) free electrons, has low electrical conductivity and supports electrostatic stresses. Dimple A feature or bump, typically a raised square on the surface of a MEMS device. Doping Process of introducing impurity atoms into a semiconductor to modify its electrical properties. DOE Design of Experiments. A specific methodology used for deriving the most meaningful data from an experiment with many variables to be determined. DRIE Deep Reactive Ion Etching. A fabrication technology. E ECR Electron Cyclotron Resonance EDM Electro-Discharge Machining EM Electro-Magnetic EPROM Electronically (Re)Programmable Read-Only Memory ETL Electro-Technical Laboratory (MITI) E/D Enhanced/Depletion EDP Ethylene Diamine Pyrocatechol, a silicon etchant like KOH or TMAH, but highly toxic. Electro Static Discharge (ESD) Static electricity; can severely damage integrated circuits. Electron Beam Lithography A method of fabricating sub-micron and nanoscale features by exposing electrically sensitive surfaces to an electron beam. The method is similar to photolithography, but uses electrons rather than photons. Since the wavelength of an electron is far smaller than that of a photon, diffraction is not a limit to the resolution. While EBL is more expensive and less parallel than photolithography, its resolution is higher and it is frequently used to create photolithographic masks. Epitaxial or epi A single crystal semiconductor layer grown upon a single crystal. Epon SU-8 (also known as SU-8) a photodefinable epoxy used to make high aspect ratio features. This material is commonly used in electroplating or polymer casting. F FEM Finite Element Method FIB Focused Ion Beam FPD Flat Panel Display G GDS II 2D mask layout Binary file format used by Foundry to generate fabrications information. These drawing eventually become masks used in photolithography. GLV Grating Light Valve. A MEMS display technology. GPIB General Purpose Interface bus, also known as HP-IB. The standard bus used for controlling electronic instruments with a computer. Also called IEEE 488 bus because it is defined by ANSI/IEEE Standards 488-1978, and 488.2-1987. GSM Groupe Speciale Mobile, or Global System for Mobile Communications. A standard for digital cellular phone service in over 85 countries H HARM High Aspect Ratio MEMS. MEMS manufacturing techniques including surface micromachining. HDL Hardware Description Language. Used by integrated circuit designers to describe what a semiconductor will do through a particular language. HDL allows designers to write the necessary specifications for their chip design. The two main HDL languages used today are Verilog and VHDL. HDL-A/MS HDL applied to Analog/Mixed Signal systems, offering an important ability to document and reuse design intellectual property. HMDS Hexamethyl disilazane. Used during the coating process, HMDS primes the wafer surface for better adhesion to photo resist. Hard Bake The baking of wafers after resist patterning, to remove solvents and moisture, and to provide for better adhesion during the etch or implant process. Hydrofluoric Acid (HF) An acid (in various dilutions) commonly used to etch oxide in many MEMS fabrication processes, such as sacrificial oxide release process. I IDMTM Information Driven Machines that Move IR Infra-Red ISFET Ion-Sensitive Field Effect Transistor IWD Integrated Waveguides by Compositional Disordering Isotropic Etch The process through which a substrate or layers are etched at the same rate in every direction Intelligent Sensor A sensor possessing such advanced features as self-calibrating, self-diagnostics, and the ability to compensate for variations in ambient conditions. The definition may vary from one manufacturer to another, but the key factor is having adequate information from which the sensor can assure validity of the measurement and the ability to communicate with other intellegent devices. J Junction The area where N and P type materials in a semi-conductor come together. L Lab-on-chip MEMS technology applied to analytical instrumentation, offering immediate or near-immediate chemical analysis and greater portability Laminar Flow Streamlined flow with no turbulence. It is a filtration system used through virtually all clean room processing operations to control airflow and velocity at workstations within the fab. The “path” the airflow takes is optimized to keep airborne particles from coming in contact with the wafers. Laser Drilling Method used to create three-dimensional structures in materials such as silicon, glass, plastics, etc., by dynamically focusing a highly collimated, monochromatic, coherent light beam at the work-piece. This process does not require any masks as opposed to conventional lithographic techniques. LATA Local Access and Transport Area LIGA A type of High Aspect Ratio Micromachining (HARM); it is a German acronym for Lithographie, Galvanofomung, Abformung, meaning Lithography, Electroforming, Molding. Lumped Parameters "lumped" parameter (co-efficient) values are determined by an averaging technique, e.g. area-weighting, to improve their ability to account for spatial variability. The advantage of a lumped parameter modeling approach is computational simplicity. M MAP Manifold Absolute Pressure. An automotive pressure sensor MAN Metropolitan Area Network. A high-speed data intra-city network that links multiple locations within a campus, city or LATA. M3S Modular Monolithic MEMS. A fabrication process. MCM Multi-Chip Module MCNC Microelectronics Center of North Carolina MEL Mechanical Engineering Laboratory (MITI) MEMS Micro-electro-mechanical systems. A technology dealing with building mechanical structures on silicon wafers using IC processing techniques. MEMS sensors already developed are primarily used for pressure and acceleration measurement. MicroFlumes Micro Fluidic Molecular Systems. Micro/chip scale systems based on fluidics. MLE Molecular Layer Epitaxy MMIC Microwave Monolithic Integrated Circuit MOEMS Micro-optical-electro mechanical systems, also known as optical MEMS. MOS Metal Oxide Semiconductor MOSFET Metal Oxide Semiconductor Field Effect Transistor MOSIS A U.S. integrated circuit foundry service MST Microsystems Technology. A more general term for MEMS. Microfluidics Study of motion of fluids at a micro-scale. Microfluidic systems comprising nozzles, pumps, reservoirs, mixers, valves, etc., can be used for a variety of applications including drug dispensing, ink-jet printing and general transport of liquid, gases and their mixtures. Advantages of microfluidics compare to conventional fluidic systems are low fabrication cost, enhancement of analytical performance, low power budget and low consumption of chemicals. Micron A unit of measure equal to 1/1,000,000 of a millimeter. N NEDO New Energy and Industrial Technology Development Organization (Japan) NETD Noise Equivalent Temperature Difference NEMS Nanoelectromechanical systems. Nanoscale MEMS NMOS N-Channel Metal Oxide Semiconductor. A transistor technology where the primary current carriers are negatively charged electrons. NRLM National Research Laboratory for Metrology Nano a prefix meaning ten to the minus ninth power, or one billionth Nanometer (nm ) A unit of measurement equal to one billionth of a meter. Nanotechnology Nanotechnology is a new technology for creating MEMS structures in the “Nano” range which is three orders of magnitude, or 1000 times smaller than the current generation of MEMS devices. Refers to devices ranging in size from a nanometer to a micron. Nitride The combination of silane and nitrogen in a CVD process to form an insulating thin film. Nitrogen A colorless, odorless gas used in a variety of fabrication processes – etching, deposition and anneal. O Optical Cross-connect A network device used by telecom carriers to switch high-speed optical signals (OC-3, 0C-12, 0C-48, etc.). It differs from digital cross-connect in that it deals with multiple high-speed signals that are switched in their entirety and not multiplexed together. Optical cross-connects work entirely at the optical layer and may be able to operate without having to convert to electrical and back again. Optical Dispersion The cause of bandwidth limitations in a fiber. Dispersion causes the spreading or broadening of light pulses as they travel through a fiber. The three major types are modal dispersion, chromatic dispersion and waveguide dispersion. Optical MEMS Micro electro-mechanical systems incorporating optics. P PAT Packaging, Assembly and Testing PGA Pin Grid Array PLZT Variation of PZT PMMA Poly Methyl Methacrylate (an electron-beam and X-ray sensitive resist) PMOS P-channel MOSFET, where the primary current carriers are positively charged "holes" PVD Plasma Vapor Deposition PVDF Polyvinylidene Fluoride Passivation Usually a silicon dioxide or silicon nitride layer deposited last to seal the circuit to protect it from moisture and/or contamination. The passivation layer is patterned and etched to open up on the bonding pads. Photo CD Measurement of the width of the CD bar patterned into photo resist. This determines if the photo pattern was produced optimally. If it is determined that the photo pattern is satisfactory, the wafers are passed on to etching. Photodiode A device that receives optical power and changes it to an electrical signal. Photolithography Carving through the use of light. Typically, a photosensitive surface (a photoresist) is selectively exposed to light using a template. The exposed areas are subsequently etched (chemically carved). Photolithographic Mask a template used in photolithography that allows selective exposure of a photosensitive surface. Piezoactuator An actuator typically producing a force or displacement in response to an electrical input signal Polysilicon Polycrystalline silicon. Used as the structural material for selected MEMS devices. R RDT Rotary Displacement Transducer RHEED Reflection High Energy Electron Diffraction RIE Reactive Ion Etch Refraction The bending of light rays as they pass through a transmission medium of one refractive index into a medium with a different refractive index. Refractive Index The ratio of the velocity of light in a vacuum to the velocity of light in a specific material. Using 1.0 as the base reference, the higher the number, the slower the speed of the lightwaves in the material. Released Layers The patterned layers containing free-standing mechanical structures that are left behind by the removal of the sacrificial layer in surface micromachining. S SAS Sensors, Actuators, and Subsystems SCREAM Single Crystal Reactive Ion Etching and Metallization. SEM Scanning Electron Microscope SIMS Secondary Ion Mass Spectroscopy SMA Shaped Memory Alloy SOI Silicon-on-Insulator SPICE Simulation Program for Integrated Circuits Emphasis. An electronic circuit simulator STM Scanning Tunneling Microscope Scanning Force Microscopy A method for observing nanoscale topography and other properties of a surface Sensor A device that responds to a physical stimulus (heat, light, sound, pressure, motion, flow, and so on), and produces a measurable corresponding electrical signal Singlemode Fiber An optical fiber in which the signal travels in one mode. It typically has an 8-10 mm core within a 125 mm cladding. Surface Micromachining An additive fabrication process, which involves the building of a device on the top surfaces of supporting substrates. T TFT Thin Film Transistor Thermal Actuator An electro-thermally actuated MEMS device TIG Tungsten Inert Gas (a type of welding) Templating The directed assembly of materials through interaction with a template. Top-Down Molding Carving and fabricating small materials and components by using larger objects such as our hands, tools, and lasers respectively. U ULSI Ultra Large-Scale Integration V VLSI Very Large-Scale Integration VSM Very Small Machines W WCVD Tungsten Chemical Vapor Deposition WEDG Wire Electric Discharge Grinding X XPS X-ray Photo-Spectroscopy Y Yield The percentage of the total number of die available on a wafer that function to specification |
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