求大家帮我查下面这篇文章的EI收录号,并麻烦附上详细信息,谢谢了!
Yong Xiao, Mingyu Li, Jongmyung Kim, Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat dissipation substrate. 14th International Conference on Electronic Packaging Technology. China.2013, 660-664.