| 查看: 337 | 回复: 6 | ||
| 【奖励】 本帖被评价6次，作者feilian990增加金币 5.5 个 | ||
| 当前主题已经存档。 | ||
[资源]
Adhesives Technology for Electronic Applications
|
||
|
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability By James J. Licari, Dale W. Swanson -------------------------------------------------------------------------------- Publisher: William Andrew Publishing Number Of Pages: 460 Publication Date: 2005-07-15 ISBN-10 / ASIN: 0815515138 ISBN-13 / EAN: 9780815515135 Binding: Hardcover -------------------------------------------------------------------------------- Product Description: This second book in the Materials and Processes for Electronic Applications Series (James J. Licari, ed.) is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as U.V., microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. Each book in the Materials and Processes for Electronic Applications Series provides theoretical foundations and practical data useful to electronics design engineers, process engineers, manufacturing engineers, quality assurance and reliability engineers, materials scientists, and polymer chemists as they strive to achieve ever more demanding electronics product features. These interdisciplinary books bridge gaps between electronics engineers and materials engineers important in advancing the state of the art. Applications cover the major industries: automotive, medical, semiconductors, space, and military. http://mihd.net/y34rxd |
回复此楼» 猜你喜欢
时间戳又变了8-15
已经有3人回复
-
哪位老哥知道今年的国自然具体哪一天放榜？
已经有6人回复
-
售SCI一区T0P文章，我:8O.55.1.O.5.4,科目齐全,可+急
已经有6人回复
-
售SCI文章，我:8O5.5.1.O.54,科目齐全,可+急
已经有7人回复
-
售SCI-T0P文章，我:8O.5.5.1.O.54,科目齐全,可+急
已经有5人回复
-
欢迎发来filecode的Mz6后的代码验证其规律
已经有50人回复
-
filecode
已经有11人回复
-
售SCI文章，我:8O.5.5.1O.54,科目全,可十急
已经有5人回复
-
售SCI一区T0P文章，我:8.O55.1.O.54,科目全,可十急
已经有5人回复
-
售SCI一区T0P文章，我:8.O55.1.O.54,科目全,可十急
已经有4人回复
2楼2008-01-25 07:24:45
简单回复
lxh6233楼
2008-01-26 09:43
回复
