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[交流] 【2014-7-25】Mathematical Problems in Engineering（SCI）-Heat Transfer Advances

截稿日期:

2014年7月25日

Heat transfer enhancement is a significant issue in the research and industry fields. The improvement of the heat transfer rates in thermal devices by adopting suitable techniques can result in significant technical advantages and cost savings. These targets could be achieved by the employment of different available techniques, divided in passive and active ones. Passive methods use special surface geometries, like rough surfaces or fluid additives to achieve the aim of heat transfer enhancement whereas the active techniques require external power sources, such as mechanical aids, electric or acoustic fields, and surface vibration. Among the available passive methods are the employment of ribbed surfaces that already covers several commercial applications, but other techniques have recently burst on the scene of engineering research, like the use of nanoparticles as additives in the working fluids in order to improve their thermal conductivity and convective heat transfer coefficients. In recent years, many attempts have been made to minimize the scales and improve the performance of devices. Traditional technologies are becoming unsuitable for heat removal from systems of small size, even of micrometric scale. For this reason, much interest is addressed to heat transfer in microchannels and porous media. The advantages of these include the ability to produce very high heat transfer coefficient, compactness, high surface-to-volume ratios, and small coolant requirements.

The aim of this special issue is to collect original research articles as well as review articles on the most recent developments and research efforts in this field, with the purpose of providing guidelines for future research directions. Potential topics include, but are not limited to:

Experimental and numerical investigations on heat transfer in microchannels, porous media, and systems for active enhancement of heat transfer
Single-phase and multiphase convection with nanofluids
Flow visualization
Applications including heat exchangers, cooling of electronics, and power generation
Transient heat transfer
System design and optimization
Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ame/hte/ according to the following timetable:

Manuscript Due Friday, 25 July 2014
First Round of Reviews Friday, 17 October 2014
Publication Date Friday, 12 December 2014

[ Last edited by workingzhang on 2014-2-6 at 13:45 ]

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