| 查看: 646 | 回复: 2 | |||
| 当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖 | |||
zhhbzhhbzhhb新虫 (初入文坛)
|
[交流]
ICESS2014 第11届嵌入式软件和系统国际会议征稿 （EI 检索） 已有2人参与
|
||
|
=============================================================== CALL FOR PAPERS ICESS 2014 The 11th IEEE International Conference on Embedded Software and Systems August 20-22, 2014 in Paris, France http://www.computational-science.org/ICESS2014/ =============================================================== *IMPORTANT DATES* Paper submission: 28 April, 2014 Notification of acceptance: 23 June, 2014 Camera-Ready due: 15 July, 2014 *SCOPE* Embedded software and systems are closely related to our daily life, which reside from smart appliances to unmanned trains. As the fastest growing industry, embedded systems will have great societal and environmental impacts. Therefore, the design and implementation of safe and efficient embedded software and systems have utmost importance. IEEE ICESS is an international forum for presenting and discussing emerging ideas and trends in embedded software and systems from both the research community as well as the industry. Topics of interest include, but are not limited to: 1. Systems, Models and Algorithms - Embedded Real-Time Systems - Embedded Hardware and Architectures - Embedded Software/Agent - Power Aware Computing - Distributed Embedded Computing - Pervasive/Ubiquitous Computing - Fault Tolerant & Trusted Embedded Systems - System on Chip (SoC) and Multicore Systems - Embedded Real-Time Operating Systems - Mobile Computing - Reconfigurable Computing - Cyber-Physical Systems 2. Design Methodology and Tools - Hardware/Software Co-Design - Formal Methods for Embedded Systems - Embedded Component Technology - Middleware for Embedded Systems - Hardware/Software Co-Verification - Compilation and Debug Techniques - IDE and Software Tools - Performance Evaluation Techniques/Tools 3. Embedded Applications and Interdisciplinary Topics - Intelligent Embedded Systems - Image and Graph Processing - Network Protocol and Security - Emergency and Disaster Management - Wireless Sensor Networks - Robotics and Control Systems - QoS Support for Embedded Systems - Embedded Database & Multimedia Systems - Consumer Electronics - Automotive, Medical and Avionics Systems *PAST HISTORY* The ICESS-2014 conference is the next event in a series of highly successful international conferences on embedded software and systems (ESS), held as ICESS 2013 (Sydney, Australia, December 2013), ICESS 2012 (Liverpool, England, UK, June 2012), ICESS 2011 (Changsha, China, November 2011), ICESS 2010 (Bradford, UK, July 2010), ICESS 2009 (Hangzhou, Zhejiang, China, May 2009), etc. *SUBMISSION INSTRUCTIONS* Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5" x 11", Two-Column, template available at http://www.computer.org/portal/web/cscps/formatting). Manuscripts should not exceed 8 pages for full papers and 4 pages for short papers, including tables and figures. All paper submissions must represent original and unpublished work. Papers must be submitted electronically in PDF format through EasyChair: https://www.easychair.org/conferences/?conf=icess2014 *PUBLICATIONS* The accepted papers from this conference will be published by IEEE Computer Society in IEEE proceedings (indexed by EI Compendex). Distinguished papers, after further revisions, will be considered for possible publication in several SCI & EI indexed special issues of prestigious international journals. By submitting a paper to the conference, authors assure that if the paper is accepted, at least one author will attend the conference and present the paper. *CONFERENCE COMMITTEES* General Chairs Julien Bourgeois, UFC/FEMTO-ST Institute, France Frédéric Magoulès, Ecole Centrale Paris, France Program Chair Haibo Zhang, University of Otago, New Zealand Steering Co-Chairs Zhaohui Wu, Zhejiang University, China Laurence T. Yang, St. Francis Xavier University, Canada |
回复此楼» 猜你喜欢
366求调剂
已经有9人回复
-
材料工程085601，270求调剂
已经有37人回复
-
279学硕食品专业求调剂院校
已经有18人回复
-
290调剂生物0860
已经有31人回复
-
一志愿085802 323分求调剂
已经有13人回复
-
277求调剂
已经有23人回复
-
322求调剂，08工科
已经有4人回复
-
材料工程281还有调剂机会吗
已经有30人回复
-
化学070300 求调剂
已经有16人回复
-
化工学硕294分，求导师收留
已经有12人回复
» 本主题相关价值贴推荐，对您同样有帮助:
- 第三届土木工程与城市规划国际会议-CEUP2014会议投稿
已经有13人回复
3楼2014-05-12 09:08:23
2楼2014-04-23 19:12:15
