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workingzhang

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[交流] 【2014-3-7】Advances in Mechanical Engineering（SCI）-Thermal Insulation Protect

截稿日期:
2014-3-7

Recent Developments in Thermal Insulation and Protection
Call for Papers

Thermal insulation is the reduction of heat transfer (the transfer of thermal energy between objects of differing temperature). Thermal protection is the prevention of heat flux (generated by outer heat resources). The practical aim of thermal insulation and protection is to keep the temperature of the objects to be within the acceptable limit. Thus, in order to obtain fluid flow, heat transfer, and other related physical phenomena in thermal insulation and protection problems, it is necessary to describe the associated physics by means of numerical/theoretical and experimental analysis. Nearly, all the physical phenomena of interest are obtained by principles of energy conservation, conversation, and management. This special issue is focused on the analysis of typical physical phenomena with respect to thermal insulation and protection.

We invite investigators to contribute original research articles as well as review articles that will stimulate the continuing efforts to understand the thermal insulation/protection problems arising from fluid flow, heat transfer, and other related physical phenomena. All submissions are expected to have original ideas and new approaches. Papers on newly emerging areas of fluid mechanics and heat transfers are especially welcomed. Potential topics include, but are not limited:

Thermal insulation and reduced heat transfer
Thermal protection and thermal shielding
Multilayer insulation and protection
Thermal performance of insulation materials
Optimization design of thermal insulation/protection structures
Thermomechanical analysis of insulation/protection systems
Numerical and optimization methods for thermal insulation/protection problems
Experimental and numerical study of thermal insulation/protection parts
Other related topics (multiscale simulation and multiobjective optimization)
Before submission authors should carefully read over the journal’s Author Guidelines, which are located at https://www.hindawi.com/journals/ame/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the Journal Manuscript Tracking System at https://mts.hindawi.com/submit/journals/ame/mtip/ according to the following timetable:

Manuscript Due        Friday, 7 March 2014
First Round of Reviews        Friday, 30 May 2014
Publication Date        Friday, 25 July 2014

[ Last edited by workingzhang on 2014-1-24 at 12:11 ]
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