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Copper nanoparticles seeded functionalized-PVC plastic surface for electroless nickel deposition
Surface Interface Analysis 2013, 45, 1899–1902
Ming-Qiu Wang, Jun Yan, Shi-Guo Du and Sheng-Hao Meng
求SCI检索号，检索不到，可用Ming-Qiu Wang或M Q Wang试试，谢谢！！
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SCI已经检索

作者: Wang, MQ (Wang, Ming-Qiu); Yan, J (Yan, Jun); Du, SG (Du, Shi-Guo); Meng, SH (Meng, Sheng-Hao)
标题: Copper nanoparticles seeded functionalized-PVC plastic surface for electroless nickel deposition
来源出版物: SURFACE AND INTERFACE ANALYSIS
卷: 45
期: 13
页: 1899-1902
DOI: 10.1002/sia.5337
出版年: DEC 2013
摘要: A novel and facile activation process for electroless nickel deposition was developed. The semi-interpenetrating polymer network hydrogel biofilm was used to functionalize the inert poly(vinyl chloride) (PVC) surface, and then Cu nanoparticles, which can initial the subsequent electroless nickel deposition successfully seeded on the functionalized-PVC surface. The samples were characterized by scanning electron microscopy, X-ray photoelectron spectroscopy, X-ray diffraction, and transmission electron microscopy. The results show that the hydrogel film provided the PVC surface with amino groups and Cu nanoparticles of 20-50nm in size could be functioned as the catalytic nuclei for the subsequent electroless metal deposition on PVC plastic. It can be concluded that the novel Cu activation was effective for the nickel deposition on PVC surface, because of more chemisorption sites for Cu nanoparticles generated on PVC surface. Copyright (c) 2013 John Wiley & Sons, Ltd.
在 Web of Science 中的被引频次: 0
在 BIOSIS Citation Index 中的被引频次: 0
在中国科学引文数据库中的被引频次: 0
SciELO Citation Index 中的 "被引频次": 0
被引频次合计: 0
ISSN: 0142-2421; 1096-9918
入藏号: WOS:000330106700012