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[求助]
求助，大家可以帮忙把这段中文翻译成英文吗？
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SECC 电解板 材质和性能与SPCC相同 材料表面增加了镀锌层，起到表面防护作用，但不具备焊锡功能，采用冲压工艺制作冲压断面没有保护层，在自然环境中会发生氧化现象。 SPCC 单光板 是冷轧板的一种。材质为优质的碳素钢，其有良好的机械性能和冲压性能。材料厚度通常小于3.0mm。素材表面无防护层，在自然环境中易氧化生锈。可以通过如下加工方式获得表面防护： 度锡 电泳 喷油 喷粉 发黑等，其中电镀后既能获得表面防护且更易焊锡，在电子产品中广泛应用。 |
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【答案】应助回帖
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gao26gao(RXMCDM代发): 金币+1, 多谢应助！ 2014-01-20 00:18:06
gao26gao(RXMCDM代发): 金币+1, 多谢应助！ 2014-01-20 00:18:06
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The surface of SECC electrolytic plate material and the performance with SPCC the same material increases the galvanized layer surface, play the effect of protective , without the function of making the solder, stamping section no protective layer by stamping process, oxidation occurs in the natural environment. SPCC single light board is a kind of cold rolled sheet. Made of quality carbon steel, which has good mechanical properties and stamping performance. The thickness of the material is usually less than 3.0mm. Material surface without protective layer, in the natural environment and easy rust. Can be obtained through the following process: surface protection of tin electrophoretic injection powder such as black, which after plating can obtain the surface protection and easier to solder, widely used in electronic products. |
2楼2013-11-26 13:14:58
3楼2013-11-26 14:59:57
【答案】应助回帖
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真强必胜: 金币+1, 谢谢 2013-12-11 08:55:03
RXMCDM: 金币+5, 多谢应助！ 2014-01-20 00:19:33
真强必胜: 金币+1, 谢谢 2013-12-11 08:55:03
RXMCDM: 金币+5, 多谢应助！ 2014-01-20 00:19:33
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The material and performance of SECC Electrolysis board is the same as SPCC. Material surface increases zinc coat which plays the role in surface protection, but does not have solder function. There is no protective layer when making stamping section by stamping process, so oxidation occurs in the natural environment. SPCC single light board is a kind of cold-rolled plate. The material is high-qualified carbon, and has good mechanical properties and stamping performance. Material thickness is generally less than 3.0mm. Material surface has no protective layer, which leads to easy oxidation and rustiness in a natural environment. Surface protection can be obtained from processing methods followed: degree tin, electrophoresis, injector, dusting, nigrescence and so on. Surface protection can be obtained after plating and easier to be soldered, and widely used in electronic products. |
4楼2013-12-11 02:26:16