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英文书“微系统封装基础”Fundamentals of Microsystems Packaging
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Fundamentals of Microsystems Packaging By Rao Tummala -------------------------------------------------------------------------------- Publisher: McGraw-Hill Professional Number Of Pages: 967 Publication Date: 2001-05-08 ISBN-10 / ASIN: 0071371699 ISBN-13 / EAN: 9780071371698 Binding: Hardcover 下载地址： http://rapidshare.com/files/66822339/0071371699.rar http://mihd.net/cfbovw -------------------------------------------------------------------------------- Book Description: LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing Download Description: Written by Rao Tummala, the field's leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. -------------------------------------------------------------------------------- Summary: A case of false advertisement Rating: 2 The purchase of this book was supposed to help me gain understanding of packaging technique, processes etc. There is very little focus on these issues in this text. The bulk of the text is concerned with basic circuit related stuff such as the basic equations for resistors, capacitors transistors and so on. I would have thought that the focus would be on packaging .. I regret purchasing this book, I consider it a 'cover-to-cover disappointment'. If you are looking for texts on packaging and you want detail, you will be better off searching for books on IC and MEMS design, since these usually address packaging it being an important design consideration. That said, I choose to give this book two stars (rather than one) since it may serve as a (very) general reference on a variety of circuit theory and may thus be useful for first year students in electrical engineering. Summary: This book is garbage Rating: 1 Nothing personal, for those who give more than 2 stars for this book, you are either a friend of the author, got the book for free, or never really review it throroughly. Here are the reason why: 1. Nothing is new in this book that you can get it off the web 2. Equations were given without fully specify its component 3. You can't work the problem in the back of the chapter because there are no materials in the chapter to support it. You need your old engineering book in order to solve these problems 4. Problems were stated unclear and incorrect. For example, he ask to calculate an N-channel MOSFET transistor problem, but the figure he used is a P-channel. It seems like the author either pull these problems out of this behind or took these problems from other engineering books and change some values to make it different, but unfortunately, those values were unworkable. 5. Pretty thick book for a lot of garbage. If I need to work electrical or heat transfer problems, I'll go to my old engineering book at least those authors know their materials. Summary: All About Microsystems Packaging Rating: 5 "Fundamentals of Microsystems Packaging" is an informative, well-written textbook, the first to cover this rapidly-evolving technology. Professor Tummala's latest book should appeal to only three groups: those who know a lot about microsystems packaging, those who know something about it, and those who know nothing about it. Microsystems packaging specialists, who typically focus on one sub-specialty, will find this detailed exposition of the entire field broadening. Non-specialists with some general packaging knowledge will find here all that they need to fully understand and work with the key elements of microsystems packaging. Novices, students, and those in related technical fields will find a well-structured introduction that prepares them to deal with microsystems packaging. This comprehensive textbook offers to all of the above groups a firm grounding in the diverse disciplines comprising microsystems packaging. Nineteen of the chapters share the title, "Fundamentals of ...". "Fundamental" means "a foundation," and that is what these chapters provide, covering the key elements of topics ranging from semiconductors to systems, including design, processing, materials, manufacture, testing, performance, reliability, thermal management, and environmental considerations. For the specialist, who must build upon these foundations, each chapter includes a judicious selection of recommended further readings. For the autodidact, the scholar, or the flagellant, there are even homework problems to test your knowledge. Four chapters, covering optoelectronics, MEMS, RF packaging, and wafer-level packaging, lead the venturesome to the borders of today's knowledge, where they might glimpse the promised land, or just gape at the dark forests of ignorance. Although the text is the child of fifty authors, the logical flow and smooth editing make it a unified work that speaks with one clear voice. Despite their diversity, the 2:1 ratio of academic to practitioner authors makes a good balance of technical rigor and practical experience. Talented illustrators provided a wealth of informative two-color pictures, charts, pictures, and diagrams. In summary, despite my forty years in microelectronics research, engineering, management, and consulting, I learned new things every time I opened this book. |
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