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当温度为峰值TP时，ωτ=1。根据方程计算出的激活能为238.9KJ/mol。实验得出的激活能与Hancock得到的镍元素的激活能接近，可以推断出Cu/Ni涂层系统在200°C时的阻尼峰应该与镍元素的扩散有关。 At peaks TP, ωτ=1, the apparent activation energy of the relaxation process was obtained as 238.9KJ/mol. The activation energy obtained in this experiment was very close to those found by Hancock for nickel as the predominant diffusing constituent in NiAl. Thus it was deduced that the damping peak of Cu/Ni coating at high temperature may be due to the process resulting from nickel element diffusion. |
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wbcui
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jiushiwaner: 金币+15, 翻译EPI+1 2013-06-13 20:12:35
jiushiwaner: 金币+15, 翻译EPI+1 2013-06-13 20:12:35
| At temperature peak TP, ωτ=1, the activation energy of the relaxation process was calculated to be 238.9KJ/mol according to equation （哪个方程？文中有给出编号的话，就加上编号或者参考）. The experimental data of Ni was very close to that obtained by Hancock(是人名么？此句需要引用文献）in NiAl. Thus it was presumed that the damping peak of Cu/Ni coating system at 200oC was due to Ni atomic diffusions. |
2楼2013-06-13 00:23:55
