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2Â¥2013-05-26 08:50:34
noel1999e
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- ·ÒëEPI: 9
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- ½ð±Ò: 144.2
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- ³æºÅ: 2480852
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°®ÓëÓêÏÂ: ½ð±Ò+1 2013-05-28 22:03:12
°®ÓëÓêÏÂ: ½ð±Ò+1 2013-05-28 22:03:12
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Cu-Cr-based (Cr <1.2wt%) alloys are widely used in electrical and electronic industries, such as the contact material and the contact wires in high-voltage switches because of its excellent electrical conductivity and high strength . Cu-Cr-based (Cr <1.2wt%) alloys are one of the main representatives of in precipitated fortified copper alloys . however, Cu-Cr alloys also have some drawbacks including poor Cr-Cu solid solution, melting point difference of approximately 800 ¡æ, poor high temperature melting uniformity and high energy consumption; Ni element can solid solute infinitely into Cu to form the ¦Á solid solution; The eutectic temperature of Cr-Ni alloys is 500 ¡æ lower than that of Cr since the adding of Cu matrix into intermediate alloys can significantly reduce the melting temperature of Cu-Cr alloy and improve organizational performance and reduce energy consumption of the alloys. Therefore, in this article , the authors are intended to introduce Cr-Ni intermediate alloys into Cu , then prepare two alloys of Cu-0.3 (Cr44Ni) and Cu-0.5 (Cr44Ni) which will be referred to as a, b alloys herein, respectively, based on the Cr-Ni alloy phase diagram eutectic point mass ratio between the two elements as a guideline. Assays including hardness test, tensile test, resistance test, optical microscope (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and transmission electron microscopy (TEM) had been used to perform systematical analysis on rolling deformation hardening, annealing softening behavior, aging behavior and solid solution aging hardening behavior in the Cu-0.3 (Cr44Ni) and Cu-0.5 (Cr44Ni) alloys, the study results had demonstrate: 1. A and b alloys will from a complete solid solution after 1000 ¡æ / 1h solid solution with a hardness of 67.3 and 75.5 HV, respectively ; Hardness is 30% higher than that of Cu concomitant with some solid solution fortifying effects; at the 450¡æ/1h, a and b solid solution alloy under different temperature and aging treatment can reach the peak hardness of 138 and 152 HV, respectively, which are approximately 100% higher than that of the solid solution alloy. Significant aging fortifying effects were demonstrated in solid solution - aging treated alloys ; the effects of rolling deformation on aging behavior suggested that deformation has little effect on the aging fortifying effects, but aging time was significantly shortened after a 75% of deformation has been reached . 2. At a rolling deformation of about 60%, alloy a has a hardness higher than that of alloy b; at a deformation greater than 60% ,alloy a has a hardness higher than that of alloy b, alloy a and b reached peak hardness of 123.7 and 132HV at alloy deformation of 60 % and 75% ,respectively ,which was significantly higher than the hardness of solid solution and significantly lower than aging hardness; solid solution hardening alloys a and b can reach peak hardness under 300 ~ 700 ¡æ / 1h annealing, which indicates that annealing conducted below 450 ¡æ / 1h had little effect on hardening process and alloy has appropriate anti - softening resistance. Alloy a and b had accomplished recrystallization at 600¡æ and 650 ¡æ,respectively, which had raised the recrystallization temperature of copper for 200 ¡æ. 3. Aging treatment effect on solution hardening showed the alloy b had a higher hardening than alloy a, and the deformation with peak hardness is the same as solution, but the peak hardness (163.5,184 HV, respectively) was significantly higher than the hardness from several other processes; solid solution hardening alloys a and b can reach peak hardness under 300 ~ 700 ¡æ / 1h annealing , which is associated with a constant hardness under annealing below 350¡æ/1h , but the ductility and conductivity can be significantly improved. 4. Alloy a and b had tensile strength of 425 and 446MPa with 1000 ¡æ / 1h solid solution water quench -450/1h aging plus 75% deformation, and the conductivity were 74.7 and 70.1% IACS, respectively; the elongation were 2.4 and 3.1 % , respectively; For the solid solution - aging - deformation treated alloys a and b , the strength still reached up to 348 and 378 MPa, elongation had improved to 8.0 and 9.7%; conductivity were of 88.4¡¢83.7% IACS , respectively . Based on the above results we conclude that the solid solution - aging - deformation -Low temperature back treated Cu-x(Cr44Ni) can achieve the combination of high strength, high ductility and high electrical conductivity , thus ,there is a good application prospect. |
3Â¥2013-05-28 12:03:02
ybin536913
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4Â¥2013-07-31 11:19:09













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