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分享热电两大红宝书，Introduction to Thermoelectricity 和 Thermoelectric_Handbook
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 分享热电两大红宝书，方便全面了解这一领域。收集不易，忘大家珍惜，仅用于学术交流，切勿商用~本人现在在做热电方向，入门菜鸟，欢迎大家交流学习 《Thermoelectric_Handbook》 目录Product Information Introduction to Thermoelectrics.........................................................................................................................................................1 Structure and Function......................................................................................................................................................................2 Temperature Control.........................................................................................................................................................................4 Parameters Required for Device Selection.........................................................................................................................................6 Sealant Options.................................................................................................................................................................................7 Thermoelectric Arrays........................................................................................................................................................................7 Design/Selection Checklist................................................................................................................................................................8 Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9 Typical Device Performance...............................................................................................................................................................9 Assembly Information Assembly Tips..................................................................................................................................................................................10 Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11 Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12 Performance and Properties Device Performance Formulae.........................................................................................................................................................13 Heat Transfer Formulae...................................................................................................................................................................14 Typical Properties of Materials (@ 21°C)........................................................................................................................................15 Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16 Introduction to Thermoelectricity 目录，截图如下：  目录1.jpg  目录2.jpg  目录3.jpg [ Last edited by zhouwenbin7 on 2013-5-14 at 20:06 ] |
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53楼2016-03-04 23:05:56
kunpeng1782: 回帖置顶 2013-05-14 11:48:48
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《Thermoelectric_Handbook》 目录 Product Information Introduction to Thermoelectrics.........................................................................................................................................................1 Structure and Function......................................................................................................................................................................2 Temperature Control.........................................................................................................................................................................4 Parameters Required for Device Selection.........................................................................................................................................6 Sealant Options.................................................................................................................................................................................7 Thermoelectric Arrays........................................................................................................................................................................7 Design/Selection Checklist................................................................................................................................................................8 Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9 Typical Device Performance...............................................................................................................................................................9 Assembly Information Assembly Tips..................................................................................................................................................................................10 Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11 Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12 Performance and Properties Device Performance Formulae.........................................................................................................................................................13 Heat Transfer Formulae...................................................................................................................................................................14 Typical Properties of Materials (@ 21°C)........................................................................................................................................15 Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16 |
2楼2013-05-13 13:05:26
3楼2013-05-13 13:09:16
简单回复
2013-05-15 12:36
回复
五星好评 顶一下，感谢分享！
yuan9996楼
2013-05-16 08:55
回复
五星好评 顶一下，感谢分享！
2013-05-19 01:46
回复
五星好评 顶一下，感谢分享！
2013-05-27 07:36
回复
五星好评 顶一下，感谢分享！
mateng_090210楼
2013-06-02 13:40
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五星好评 顶一下，感谢分享！
jtkdpangzi11楼
2013-06-02 15:22
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五星好评 顶一下，感谢分享！
xmmec12楼
2013-06-05 17:02
回复
五星好评 顶一下，感谢分享！
gongxd32513楼
2013-06-26 19:29
回复
五星好评 顶一下，感谢分享！
gengxin6014楼
2013-06-26 21:52
回复
顶一下，感谢分享！
