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360190168捐助贵宾 (小有名气)
smile龙
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[求助]
高分子化学-论文摘要-求翻译
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?????????????????·????С?????????????????????????????????????????????????????????????????????????????????????轺???????????????????????????????????????????????????????????????????????????????????????轺??????????о???????轺????????????????????????????????????????????轺?????о???????仯??????????????????????衢??????????????4????????????????????Χ??????????????轺???????????????????????????????????轺???????????????????????????轺???????????????????轺???????о????????????轺????????????90?档![]() |
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wxdlmc
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Carena: 译文有很多语法错误,句子的表达也欠妥 2013-05-02 16:31:12
360190168: 金币+50, 翻译EPI+1, ★★★很有帮助, 老师说合格了 2013-05-03 18:46:16
Carena: 译文有很多语法错误,句子的表达也欠妥 2013-05-02 16:31:12
360190168: 金币+50, 翻译EPI+1, ★★★很有帮助, 老师说合格了 2013-05-03 18:46:16
| With the development of microelectronic packaging and integrated circuit develops toward miniaturization and micromation, components power improvement, diversification, electrical components to the complicated working environment, put forward higher request to the electrical stability. Silicone is a kind of new high-quality potting material, for its excellent work temperature, weather resistance, heat resistance, insulation performance has become the preferred sealant. In this experiment, through the adjustment of addition-cured silicone composition proportion, effect on the gel properties of components, to find the optimal component ratio. By adding different filler modified silica gel, and study its performance changes, that in aluminum nitride, silicon nitride, boron nitride and titanium dioxide 4 fillers, addition amount in a certain range, can improve the tensile properties of silica gel; adding aluminum nitride, boron nitride can improve the thermal conductivity of silica gel; insulation resistance has little effect on the amount of silica to aluminum nitride, can improve the hardness of silicone. The optimal curing study that the experimental gel for degree is 90 ℃ |
2楼2013-04-30 19:46:48
360190168
捐助贵宾 (小有名气)
smile龙
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3楼2013-05-02 09:34:17














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