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electroless plating-fundamentals and applications
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electroless plating-fundamentals and applications The term "electroless plating" describes the methods of depositing metals and alloys by means of electrochemical reactions. However, chemical plating is the more accurate term that can be used to denote the several means of metal deposition without the application of electric current from an external source. Hence, immersion deposition, as well as electroless deposition, covered in this book, are two forms of chemical plating. In usage, the term "electroless plating," as coined by Abner Brenner, has come to be synonymous with autocatalytic plating. In this process, the chemical reaction proceeds continuously on selected surfaces, providing the means to produce uniform coatings with unique properties on a wide variety of substrates. The practice of electroless plating is a relatively young art, developed over the past fifty years for a large number of applications. Several major industries, such as printed circuit boards, hard memory disks and electroplated plastics were made possible by the development of electroless technology. This book describes the chemical principles of the major electroless processes and the practical applications of these techniques in industry. Of the different electroless processes available, electroless nickel and electroless copper have gained the largest industrial use and are discussed extensively. Other electroless plating processes and related subjects are discussed in individual chapters. A limited number of techniques, mentioned in the literature, that have no experimental proof or applications background were not included. It is important to note here that electroless plating is a fast-growing field and the references should be updated continuously. Two points should be made on editorial decisions. As a result of our intention to cover both principles and applications of electroless plating, some subjects required a theoretical approach, while other subjects demanded pragmatic and descriptive treatment. For this reason, the authors had very few constraints on style, format, units and the general outlay of their chapters. In addition to electroless plating, immersion plating is reviewed. While this process is not based strictly on chemical reduction, it is closely related to electroless plating in industrial applications. The editors would like to express their gratitude to the many persons who have made this book a reality: First of all to the authors for their cooperation and patience; to the staff and authorities of the American Electroplaters and Surface Finishers Society for their help and support; and to the members of the Electroless Finishing Committee, eSpeCiallY to our colleagues, Michael Aleksinas, Dr. Moe El-Shazly, David Kunces, CEF, and Fred Pearlstein, CEF, in reviewing the manuscripts. Special thanks are also due Harry Litsch, CEF-SE, for preparing the index. No work on the subject of electroless plating should be published without acknowledging the industry's lasting debt to the pioneering work of Dr. Abner Brenner. We hope this book will fill the void which has existed for a complete reference on electroless deposition, and that you will find it a most useful addition to your library. 56邮箱共享： qftian@56.com 已重新上传，需要的虫虫可以去下载！ [ Last edited by Rainycc on 2009-3-5 at 17:07 ] |
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