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[资源] electroless plating-fundamentals and applications

electroless plating-fundamentals and applications

The term "electroless plating" describes the methods of depositing metals and alloys
by means of electrochemical reactions. However, chemical plating is the more
accurate term that can be used to denote the several means of metal deposition
without the application of electric current from an external source. Hence,
immersion deposition, as well as electroless deposition, covered in this book, are two
forms of chemical plating. In usage, the term "electroless plating," as coined by
Abner Brenner, has come to be synonymous with autocatalytic plating. In this
process, the chemical reaction proceeds continuously on selected surfaces,
providing the means to produce uniform coatings with unique properties on a wide
variety of substrates.
The practice of electroless plating is a relatively young art, developed over the past
fifty years for a large number of applications. Several major industries, such as
printed circuit boards, hard memory disks and electroplated plastics were made
possible by the development of electroless technology. This book describes the
chemical principles of the major electroless processes and the practical applications
of these techniques in industry. Of the different electroless processes available,
electroless nickel and electroless copper have gained the largest industrial use and
are discussed extensively. Other electroless plating processes and related subjects
are discussed in individual chapters. A limited number of techniques, mentioned in
the literature, that have no experimental proof or applications background were not
included. It is important to note here that electroless plating is a fast-growing field
and the references should be updated continuously.
Two points should be made on editorial decisions. As a result of our intention to
cover both principles and applications of electroless plating, some subjects required
a theoretical approach, while other subjects demanded pragmatic and descriptive
treatment. For this reason, the authors had very few constraints on style, format,
units and the general outlay of their chapters.
In addition to electroless plating, immersion plating is reviewed. While this process
is not based strictly on chemical reduction, it is closely related to electroless plating
in industrial applications.
The editors would like to express their gratitude to the many persons who have
made this book a reality: First of all to the authors for their cooperation and patience;
to the staff and authorities of the American Electroplaters and Surface Finishers
Society for their help and support; and to the members of the Electroless Finishing
Committee, eSpeCiallY to our colleagues, Michael Aleksinas, Dr. Moe El-Shazly,
David Kunces, CEF, and Fred Pearlstein, CEF, in reviewing the manuscripts. Special
thanks are also due Harry Litsch, CEF-SE, for preparing the index.
No work on the subject of electroless plating should be published without
acknowledging the industry's lasting debt to the pioneering work of Dr. Abner
Brenner.
We hope this book will fill the void which has existed for a complete reference on
electroless deposition, and that you will find it a most useful addition to your library.

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