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[资源] 现代电镀（第五版）英语原版

1 Fundamental Considerations (Milan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder).
2 镀铜 (Jack W. Dini and Dexter D. Snyder).
3 镀镍 (George A. Di Bari).
4 镀金 (Paul A. Kohl).
5 化学镀和电镀银 (Mordechay Schlesinger).
6 Tin and Tin Alloys for Lead-Free Solder (Yun Zhang).
7 镀鉻(Nenad V. Mandich and Donald L. Snyder).
8 镀铅和铅合金 (Manfred Jordan).
9 镀锡和锡合金 (Manfred Jordan).
10 镀锌和锌合金(Ren Winand).
11 镀铁和铁合金s (Masanobu Izaki).
12 镀钯 (Joseph A. Abys).
13 Electrochemical Deposition Process for ULSI Interconnection Devices (Tetsuya Osaka and Masahiro Yoshino).
14 半导体电镀 (T. E. Schlesinger, K. Rajeshwar, and N. R. De Tacconi).
15 非金属电镀 (Mordechay Schlesinger).
16 Conductive Polymers: Electroplating of Organic Films (Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma).
17 化学镀铜 (Milan Paunovic).
18 化学镀镍 (Mordechay Schlesinger).
19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems (Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka).
20 化学镀钯和铂 (Izumi Ohno).
21 化学镀金 (Yutaka Okinaka and Masaru Kato).
22 化学镀合金 (Izumi Ohno).
23 Preparation for Deposition (Dexter D. Snyder).
24 Manufacturing Tools (Tom Ritzdorf).
25 Monitoring and Control (Tom Ritzdorf).
26 Environmental Aspects of Electrodeposition (Micha Tomkiewicz).
27 Applications to Magnetic Recording and Microelectronic Technologies (Stanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov).
28 Microelectromechanical Systems (Giovanni Zangari).
29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques (Xianying Meng-Burany).
30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates (R. Petro, M. Schlesinger, and Guang-Ling Song).

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