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[求助]
求助翻译一段摘要，非常感谢
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| 为了解决A在表面电镀过程中晶间富钕相易被电解液腐蚀的问题，我们提出A经过磷化和镀铜双重涂层保护技术，也就是：先让A的晶间相通过磷化工艺生成钝态的磷化产物，然后在这基础上进行碱性镀铜。分别采用SEM和电化学方法观察了磷化后A的表面形貌和耐腐蚀性能。结合EDS分析结果，讨论了磷化膜的形成机理。对短时间磷化并镀铜的A进行断面观察和耐蚀分析。结果表明：A的晶间相比主晶相优先形成磷化产物；在短时间磷化后，A的晶间相就覆盖磷化产物，并使磁体的耐蚀性获得明显提高。磷化产物主要是钕和铁的磷酸盐产物，并可能有钕氧化物，并且晶间相磷化膜的Nd含量要高于主晶相。A通过晶间磷化再电沉积铜的协同保护下，耐蚀性显著优于单独磷化膜或单独镀层保护。 |
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【答案】应助回帖
★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ...
phu_grassman: 金币+5, thanks for your kind help. 2013-02-27 13:31:17
zhingjw: 金币+50, 翻译EPI+1, ★★★★★最佳答案, 谢谢 2013-02-28 00:57:19
phu_grassman: 金币+5, thanks for your kind help. 2013-02-27 13:31:17
zhingjw: 金币+50, 翻译EPI+1, ★★★★★最佳答案, 谢谢 2013-02-28 00:57:19
To solve the susceptibility of A's intergranular Nd-rich phase to electrolytic corrosion during surface electroplating, we proposed a double coating protection technique for A including phosphorization and copper plating, in other words, the A's intergranular phase is allowed to generate passive phosphorization products through phosphorizing process, folllowed by alkaline copper plating. The surface topography and corrosion resistance of the phosphorized A were observed using SEM and electrochemical method respectively. Based on the above data as well as EDS analysis results, the formation mechanism of the phosphorized film was discussed. For A that has been phosphorized and copper plated for a short time, sectional examination and corrosion resistance analysis were done. The results indicate that, the intergranular phase of A forms the phosphorization products preferably than the main crystal phase of A; just after a short time phosphorization, the A's intergranular phase has covered the phosphorization product and enabled the corrosion resistance of the magnetic body significantly improved. The main phosphorization products are Nd and Fe phosphates, and probably Nd oxides, and Nd content of the intergranular phase's phosphorized film is higher than that of the main crystal phase. With synergistic protection of A through intergranular phosphorization followed by copper electrodeposition, its corrosion resistance is significantly better than that with a single phosphorized film or single plating protection.  |
2楼2013-02-27 11:33:12