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MICROSYSTEM DESIGN（已搜索，无重复）
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MEMS方面的一本很不错的书籍，黄庆安译著原版，建议大家读一读 By Stephen D. Senturia The goal of this book is to bring together into one accessible text the fun-damentals of the many disciplines needed by today’s microsystems engineer. The subject matter is wide ranging: microfabrication, mechanics, heat flow, electronics, noise, and dynamics of systems, with and without feedback. And because it is very difficult to enunciate principles of “good design” in the ab-stract, the book is organized around a set of Case Studies that are based on real products, or, where appropriately well-documented products could not be found, on thoroughly published prototype work. This book had its roots in a graduate course on “Design and Fabrication of MEMS Devices” which my colleague Prof. Martin Schmidt and I co-taught for the first time in the Fall of 1997. I then offered it as a solo flight in the Spring of 1999. Our goal was to exploit our highly interdisciplinary student mix, with students from electrical, mechanical, aeronautical, and chemical engineering. We used design projects carried out by teams of four students as the focus of the semester, and with this mix of students, we could assign to each team someone experienced in microfabrication, another who really understood system dynamics, another with background in electronics, and so on. Lectures for the first two-thirds of the semester presented the material that, now in much expanded form, comprises the first sixteen chapters of this book. Then, while the teams of students were hard at work on their own design problems (more on this below), we presented a series of lectures on various case studies from current MEMS practice.  无标题.png Contents： Part I GETTING STARTED 1. Introduction.............................................................................3 2 An approach to MEMS design...................................................15 3 Microfabrication........................................................................29 4 Process integration...................................................................79 Part II MODELING STRATEGIES 5 Lumped modeling...................................................................103 6 Energy-conserving transducers..............................................125 7 Dynamics...............................................................................149 Part III DOMAIN-SPECIFIC DETAILS 8 Elasticity.................................................................................183 9 Structures..............................................................................201 10 Energy methods..................................................................239 11 Dissipation and the thermal energy domain..........................267 12 Lumped modeing of dissipative precesses.............................299 13 Fludis...................................................................................317 Part IV CIRCUIT AND SYSTEM ISSUES 14 Electronics............................................................................353 15 Feedback systems................................................................397 16 Nose.....................................................................................425 Part V CASE STUDIES 17 Packaging.............................................................................453 18 Apiezoresistive prsessure sensor............................................469 19 Acapacitive accelerometer.....................................................497 20 Electrostatic proiection displays.............................................531 21A piezoelectric rate gyroscope................................................561 22 DNA amplification..................................................................605 23 A microbridge gas sensor......................................................629 [ Last edited by yj656 on 2013-1-26 at 13:36 ] |
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