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Çë½Ì¸÷λ´óÉñ£º IEEEÂÛÎÄwordÅŰæÊ×Ò³Ò³½ÅµÄÎÄ×ֽ϶àʱ£¬»áÓÐÒ»²¿·ÖÎÄ×Ö×Ô¶¯×ªÈëÊ×Ò³µÚ¶þÁÐÒ³½Å¡£ÈçºÎ´¦Àí£¬²ÅÄÜÈÃÕâЩÎÄ×ÖÀÏʵ¶¼´ôÔÚµÚÒ»ÁÐÒ³½Å²¿·ÖÄØ£¿ PS£ºÔÚIEEE¹Ù·½Ä£°åÖУ¬Õâ¸öÒ³½ÅËÆºõÊÇÓëÕªÒªÒ»ÆðÉèÖøñʽµÄ£¬²»ÖªµÀÈçºÎ¸ü¸Ä£¿ ¾ÍÊÇÀàËÆÏÂÃæÕâЩÎÄ×Ö£º Manuscript received October 9, 2001. (Write the date on which you submitted your paper for review.) This work was supported in part by the U.S. Depart¬ment of Com¬merce under Grant BS123456 . F. A. Author is with the National Institute of Standards and Technology, Boulder, CO 80305 USA (corresponding author to provide phone: 303-555-5555; fax: 303-555-5555; e-mail: author@ boulder.nist.gov). S. B. Author, Jr., was with Rice University, Houston, TX 77005 USA. He is now with the Department of Physics, Colorado State University, Fort Collins, CO 80523 USA (e-mail: author@lamar.colostate.edu). T. C. Author is with the Electrical Engineering Department, University of Colorado, Boulder, CO 80309 USA, on leave from the National Research Institute for Metals, Tsukuba, Japan (e-mail: author@nrim.go.jp). |
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