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[求助] 应用聚合物科学期刊的投稿信

我想求助最新版的应用聚合物科学的投稿信模板,内容要求是
Cover letter
Your cover letter should contain a brief summary of the submitted work and answer the following key questions:
Why is this topic important?
Why are the results significant?
What is the key result?
What is the advance on previous work?
Why are you submitting it to this journal?
Why will the journal's audience be interested in this paper?
What applications is the technology described in the manuscript going to be useful for?
In addition, the cover letter should disclose scientific or financial conflicts of interest, list related papers in press or under consideration elsewhere, and provide suggestions for qualified reviewers in the field. Up to three non-preferred reviewers can also be listed. Please note the editors will normally honor requests to exclude non-preferred reviewers whenever possible
谁最近往这个期刊投过文章,把你们的投稿信模板给我借鉴一下,万分感谢
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