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È«Êé¹²270Ò³£¬½²ÊöÁ˹¦Âʰ뵼ÌåÆ÷¼þµÄ¹¤×÷ÔÀí¡¢Éè¼Æ·½·¨¡¢ÒÔ¼°Ó¦ÓÃÖеÄ×¢ÒâÊÂÏî¡£±¾ÊéÀíÂÛÐÔÇ¿£¬Í¬Ê±ÓÖÊÇÒ»±¾¹¦ÂÊÆ÷¼þ¾ßÌåÓ¦ÓõÄÖ¸µ¼Ê顣Ŀ¼ÈçÏ£º 0.Operation principle of power semiconductors 0.1 Basic switching processes 0.2 Operation principle of power semiconductors 0.3 Power electronic switches 1.Basics 1.1 Application fields and today¡¯s application limits of IGBT and MOSFET power modules 1.2 Power MOSFET and IGBT 1.3 Free-wheeling- and snubber-diodes 1.4 Power modules: special features of multi-chip structures 1.5 Examples for new packaging technologies 1.6 Integration of sensors, protective functions, drivers and intelligence 2.2 Datasheet parameters for MOSFET, IGBT, MiniSKiiP- and SKiiPPACK modules 2.1 General 2.2 Power MOSFET modules 2.3 IGBT-modules 2.4 Special parameters for MiniSKiiPs 2.5 Special parameters for SKiiPPACKs 2.6 Temperature dependency of static and dynamic characteristics of power modules 2.7 Reliability 3 Hints for application 3.1 Dimensioning and selection of MOSFET, IGBT and SKiiPPACK modules 3.2 Thermal behaviour 3.3 Cooling of power modules 3.4 Power design 3.5 Driver 3.6 Fault behaviour and protection 3.7 Parallel and series connection of MOSFET, IGBT and SKiiPPACK modules 3.8 Soft switching in ZVS or ZCS-mode / switching loss reduction networks 3.9 Handling of MOSFET, IGBT, MiniSKiiP and SKiiPPACK modules http://www.ieechina.com/upload/books/application_manual.pdf [ Last edited by sdlj8051 on 2006-12-25 at 18:49 ] |
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