| 查看: 399 | 回复: 3 | |||
| 【奖励】 本帖被评价3次，作者micro_nanost增加金币 3 个 | |||
| 当前主题已经存档。 | |||
[资源]
【e-book】CRC: The Electronic Packaging Handbook
|
|||
|
The Electronic Packaging Handbook Author: Glenn R. Blackwell ISBN: 0849385911 | Publisher: CRC | Number Of Pages: 640 | PDF | 13.2 mb Review …highly recommended…enough detail…provides essential factural information on the design, manufacturing, and testing of electronic devices and systems…this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products…The book ties together well with references between chapters…well written and edited…each chapter includes a section of bibliographic references and suggested readings. --Dave Fish, Pandion Electronics, Inc., SMTnet.com Book Description The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.  [ Last edited by tangsd2 on 2007-4-4 at 13:11 ] |
回复此楼» 猜你喜欢
售SCI一区T0P文章，我:8.O.55.1.O.5.4,科目全,可+急
已经有7人回复
-
售一区SCI文章T0P，我:8O.551.O54,科目全,可十急
已经有4人回复
-
售SCI一区T0P文章，我:8.O.55.1.O.54,科目齐全,可+急
已经有7人回复
-
售SCI-T0P文章，我:8O.5.5.1.O.54,科目齐全,可+急
已经有9人回复
-
售SCI一区T0P文章，我:8.O.55.1.O.54,科目齐全,可+急
已经有7人回复
-
售SCI一区文章，我:8.O.55.1.O.54,科目齐全,可伽急
已经有10人回复
-
售SCI一区文章，我:8O5.5.1.O5.4,科目全,可伽急
已经有10人回复
-
售一区SCI文章T0P，我:8O.551.O54,科目全,可十急
已经有8人回复
-
售SCI-T0P文章，我:8O.5.5.1.O.54,科目齐全,可+急
已经有9人回复
-
售SCI一区文章，我:8.O.55.1.O.54,科目齐全,可伽急
已经有11人回复
2楼2006-12-08 15:02:54
3楼2006-12-08 20:49:29
4楼2006-12-09 10:22:39
