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hjhw9513木虫 (著名写手)
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Area Array Packaging Handbook: Manufacturing and Assembly
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ISBN: 0071374930 | Author: Ken Gilleo | Publisher: McGraw-Hill Professional | Publication Date: 2001-11-05 | Number Of Pages: 1000 | Average Amazon Rating: 4.5 | Filetype: PDF | Filesize: 20.0M Book Description *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI) Book Info Covers design, packaging, construction, assembly, and application all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Examines packaging ramifications of high density interconnects (HDI). http://rapidshare.com/files/4630 ... ring_n_Assembly.pdf |
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