| 查看: 136 | 回复: 0 | |||
| 当前主题已经存档。 | |||
hjhw9513木虫 (著名写手)
|
[交流]
Area Array Packaging Handbook: Manufacturing and Assembly
|
||
|
ISBN: 0071374930 | Author: Ken Gilleo | Publisher: McGraw-Hill Professional | Publication Date: 2001-11-05 | Number Of Pages: 1000 | Average Amazon Rating: 4.5 | Filetype: PDF | Filesize: 20.0M Book Description *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI) Book Info Covers design, packaging, construction, assembly, and application all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Examines packaging ramifications of high density interconnects (HDI). http://rapidshare.com/files/4630 ... ring_n_Assembly.pdf |
回复此楼» 猜你喜欢
E0414, 我的本子有没有希望？
已经有9人回复
-
青A35岁以下通知答辩了吗
已经有3人回复
-
【全奖博士/科研助理/博后招生】新加坡南洋理工大学机械与航空航天学院
已经有4人回复
-
希望面上有个好结果
已经有7人回复
-
三区计算机方向期刊推荐
已经有5人回复
-
sci论文二审求助
已经有5人回复