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The microstructural evolution of the SMAT Cu samples was characterized by using a JEM-2010 transmission electron microscope (TEM) operated at a voltage of 200 kV. Cross-sectional thin foils for TEM observations were prepared in the following steps: (i) electroplating a Ni layer of 1.5 mm thick onto the treated surface of the SMAT Cu samples; (ii) cutting a cross-sectional piece of the electroplated sample (with a diameter of 3 mm and a thickness Acta Materialia 54 (2006) 5281¨C5291 of 0.5 mm) with the treated surface in the middle; (iii) grinding it carefully to about 30 lm thick; (iv) dimpling and ion thinning to perforation at room temperature. |
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