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zhingjw

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研究A镀铜液中B对铜还原和氧化过程的影响。用Hull槽测试阴极电流密度分布，通过电位扫描、循环伏安和交流阻抗曲线研究铜沉积的电化学行为，通过镀液的吸光度测试和固体配合物的红外光谱分析推断配位化合物的形式。结果表明：B的加入能够扩大A镀铜体系的阴极允许电流密度，对铜电沉积有阻化作用，促进铜阳极溶解，并可抑制氢气的析出；随着溶液中B浓度增加，在玻碳电极上发生的铜还原过程由电化学控制逐渐转变为扩散控制。B的加入，主要是在A镀铜体系中形成CuTEA(OH)2配位化合物，并吸附在电极表面而影响电化学反应。

The effect of B on copper about reduction and oxidation process from a A electrolyte is investigated. Electrochemical measurements like cyclic voltammetry (CV),EIS and potentiodynamic polarization techinique are used to research the electrochemical behavior of copper deposition, the distribution of cathode current density is tested by hull cell, and also using the IR spectra of the complex and the Absorbance curves of the electrolyte to analysis and conclude the form of coordination compounds. The results showed that: the addition of B can expand A electrolyte cathode current density, inhibit the copper electrodeposition, promote the dissolution of copper anode, and can inhibit the liberation of hydrogen; the reduction process of copper control by electrochemical occurred at a glassy carbon electrode gradually transformed into diffusion control with the B concentration increasing in solution. The addition of B in A electrolyte mainly to form the CuTEA(OH)2 coordination compounds, and adsorb on the electrode surface to affect the electrochemical reaction.

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1楼 2011-03-15 15:04:18

已阅回复此楼关注TA 给TA发消息送TA红花 TA的回帖

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zhingjw(金币+10, 翻译EPI+1): 谢谢帮我在时态上进行改正！ 2011-03-15 21:00:58

The effect of B on copper in the reduction and oxidation process in electrolyte A was investigated. Electrochemical measurements like cyclic voltammetry (CV),EIS and potentiodynamic polarization techinique were used to study the electrochemical behavior of copper deposition; the distribution of cathode current density was tested through hull cell; the IR spectra of the complex and the Absorbance curves of the electrolyte to analysis was used to characterise the coordination compounds. The results showed that: the addition of B could expand A electrolyte cathode current density, inhibit the copper electrodeposition, promote the dissolution of copper anode, and inhibit the liberation of hydrogen; the reduction process of copper control by electrochemical occurred at a glassy carbon electrode gradually transformed into diffusion control with the B concentration increasing in solution. The addition of B in electrolyte A was mainly to form the CuTEA(OH)2 coordination compounds, and to adsorb on the electrode surface to affect the electrochemical reaction.

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