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[交流] 【工学】【2011-05-25】2011年机电一体化与材料加工国际会议(ICMMP2011)—SCI、EI收录

会议城市:

中国广州

截稿日期:

2011年05月25日

2011 International Conference on Mechatronics and Materials Processing (ICMMP2011)
2011年机电一体化与材料加工国际会议(ICMMP2011)
2011年11月18日—20日；中国广州

https://www.icmmp.org

主办单位：澳大利亚新南威尔士大学；浙江大学；西安交通大学；香港理工大学；广州大学

大会主席：Liangchi Zhang院士，澳大利亚工程院院士、新南威尔士大学Scientia教授和终身教授

大会联合主席：陈子辰教授，浙江大学

征文通知

2011年机电一体化与材料加工国际会议(ICMMP 2011)将于2011年11月18日—20日在中国广州召开。会议主题包括材料科学与技术、制造技术与加工工艺、机电一体化与自动化、工程教育与培训等。会议内容涵盖了机电一体化与材料加工领域的主要研究方向，会议旨在为全世界机电一体化与材料加工领域的专家、学者和专业技术人员提供一个交流最新研究成果的机会。热忱欢迎从事机电一体化与材料加工技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。
本次会议经同行专家评审录用的论文将全部出版在国际期刊《Advanced Materials Research》上，在该刊物上发表的论文将全部被EI Compendex和ISTP收录。100多篇优秀的论文将推荐到下列SCI收录的国际期刊上发表：
Materials and Manufacturing Processes
Surface Engineering
Surface Science and Engineering
Advanced Science Letters

征文要求

会议语言为英语，请务必用英语撰写论文。所投论文应在国内外未曾公开发表过，在理论或应用方面有创见。论文须严格按《Advanced Materials Research》的要求撰写（格式模板文件见会议网址：https://www.icmmp.org）。投稿时请同时提交论文的MS Word版本及PDF版本。

论文全文提交方式：通过E-mail以邮件附件的形式将你的论文全文以及填写完毕的论文登记表提交给组委会（icmmpx@gmail.com）。本会议无需提前投摘要。

重要日期

论文全文提交截止日期：          2011年5月10日截稿日期延期至2011年5月25日
论文录用通知日期：                2011年6月10日
修改论文提交与注册截止日期：2011年7月1日
会议时间：                            2011年11月18日—20日

会议注册

每篇录用论文必须注册方可发表。注册费为2600元人民币/篇或400美元/篇。如论文超过4页，每超1页需另加300元人民币或50美元。每篇录用论文至少一名作者注册，方可发表。以第一作者身份投多篇论文，从第二篇起论文注册费降为2300元。如果论文被推荐到SCI收录期刊上发表，则需要交纳额外的出版费。

联系方式
E-mail: icmmpx@gmail.com（推荐采用）
网址：https://www.icmmp.org
电话: +86 20 3936 6470
地址：广州市大学城外环西路230号广州大学机械与电气工程学院ICMMP2011组委会，  510006

--------------------------------------------------------------------------------------------------------------------------

2011 International Conference on Mechatronics and Materials Processing (ICMMP 2011)
November 18-20 2011,GuangzhouChina

https://www.icmmp.org

Call for Papers

2011 International Conference on Mechatronics and Materials Processing (ICMMP2011)will be held during November 18-20, 2011, inGuangzhou,China.ICMMP2011 aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Mechatronics and Materials Processing. All accepted papers will be published in international journal "Advanced Materials Research" [ISSN:1022-6680, Trans Tech Publications] and will be indexed in the major academic databases, includingEI Compendex, Thomson ISI (ISTP),and other indexing services(See TTP's Conference List). The full text is online available via platformwww.scientific.net. Trans Tech Publicationswill provideonline camera-ready paper submission system.Over 100 selected excellent papers will be published in SCI-indexed journals:Materials and Manufacturing Processes (Taylor & Francis),Surface Engineering (Maney Publishing),Surface Science and Engineering, Advanced Science Letters(American Scientific Publishers).

Topics of interest include, but are not limited to:
(I) Material Science and Technology
(01) Nanomaterials
(02) Composites and polymer materials
(03) Biomaterials
(04) Semi-conductor and micro-electronic materials
(05) Smart/Intelligent Materials/Intelligent Systems
(06) Thin Films
(07) New Functional Materials
(08) Metal alloy materials
(09) Iron and Steel
(10) Building Materials
(11) Materials forming
(12) Coatings and surface engineering
(13) Materials Characterization
(14) Mechanical Behavior & Fracture
(15) Testing and Evaluation of Materials
(II)  Manufacturing Technology and Processing
(16) Modeling, analysis and simulation of manufacturing processes
(17) High-speed/precision machining
(18) CAD/CAM/ CAE
(19) Virtual manufacturing and concurrent engineering
(20) Green design and manufacturing
(21) Digital and agile manufacturing
(22) PDM, ERP, logistics and supply chain
(23) Bionic mechanisms and bio-manufacturing
(24) Tribology in Manufacturing Processes
(25) Integrated Manufacturing System
(26) Laser Processing Technology
(27) Materials Machining
(28) Micro- and nano-fabrication, materials processing and technology
(29) Thermal Engineering Theory and Applications
(30) Testing, measuring, monitoring and controlling of manufacturing processes
(31) Engineering Optimization
(32) Product Design and Development
(33) Project/Engineering Management
(III) Mechatronics and Automation
(34) Mechatronics
(35) Industrial Robotics and Automation
(36) Intelligent control, neuro-control, fuzzy control
(37) Industrial Automation and Process Control
(38) Distributed Control System
(39) Embedded System
(40) Control system modeling and simulation techniques
(41)Enterprise Informationization and information processing technology
(42)Virtual Instrumentation
(43)Sensors, multi-sensor data fusion algorithms
(44)Advanced measurement and Machine Vision system
(45)Transmission and control of Fluid
(46)Dynamics, Vibration and Control
(IV)  Engineering Education and Training
(47) Engineering education and training
(V)  Other related topics
(48)  Other related topics

Paper Submission

All papers must be written in English. Please prepare your paper in strict accordance with the format available at the conference website (https://www.icmmp.org). And submit your papers and the filed Paper Submission Form by email attachment to the ICMMP2011 Conference organizer (icmmpx@gmail.com)by the given deadline. All papers should beno less than 4 pagesin length and shorter papers should not be included in the journal. Document file in PDF and MS Word format are both required when submitting your papers.

Important Dates(Deadline)

Submission of full Papers：                         May 25, 2011
Notification of Papers Acceptance：             June 10, 2011
Camera Ready Submission and Registration：July 1, 2011
Conference：                                              November 18-20, 2011

Registration

The registration fee is 400 U.S. Dollars or 2600 RMB for each paper (over 4 pages extra-charge 50 U.S. Dollars or 300 RMB per page needs to be paid). Only one paper can be included into the journal by paying one registration fee; you can pay Extra Paper Charges (2300 RMB or 350 U.S. Dollars) for one more paper from the same first author who already has a paid registration. Extra-charge for Papers, which will be published in SCI-indexed journals, needs to be paid.

Sponsors

TheUniversityofNew South Wales,Australia
Zhejiang University, China
Xi’anJiaotong University,China
TheHong KongPolytechnicUniversity,Hong Kong
Guangzhou University,China
Trans Tech Publications Inc.
Materials and Manufacturing Processes (Taylor & Francis)
Surface Engineering (Maney Publishing)
Advanced Science Letters (American Scientific Publishers)

Contact Information
E-mail: icmmpx@gmail.com
Website: https://www.icmmp.org
Tel: +86 20 3936 6470
School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China

[ Last edited by xuanzhang on 2011-5-15 at 07:38 ]

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