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[交流] TMEI2011_I.C. Teaching Materials, Education and Information Technology(Ei,ISTP) 已有2人参与

2011 International Conference on Teaching Materials, Education and Information Technology (TMEI2011)
August 21-22,Wuhan, China
https://iser-association.org/TMEI2011

该会议由国际科教研究者协会和瑞士的TTP联合主办。该会议所有录用的论文均出版在国际EI期刊Advanced Materials Research正刊上，会议所有的论文将会被EI compendex检索，期刊号ISSN: 1022-6680。该期刊收录的论文以检索快质量高而著称，目前为止，该期刊出版的论文一般是在会后三个月左右检索。
（1）官方网站：https://iser-association.org/TMEI2011/
（2）投稿系统：https://www.easychair.org/conferences/?conf=tmei2011
（3）官方博客：https://blog.163.com/temi2011/
（4）该会议已经进入科学网：https://meeting.sciencenet.cn/cinfo.aspx?cid=1011
（5）该会议已进入维普学术网：https://expo.cqvip.com/meet_detail.asp?id=212
（6）该会议基本问题已经进入湖北工业大学大学资讯网：
https://www.jx051.cn/index.php/post/view/id-23003
（7）本会议已进入ISER协会会议列表：
https://iser-association.org/html/Academic/index-Academic.htm

TMEI2011 is a leading annual conference of ISER Association for all researchers home and abroad. With the rapid development of industry and information technology, researchers in all fields begin to discuss some new ideas connected with information technology. TMEI2011 will provide a valuable opportunity for researchers ,scholars and some scientists to exchange their ideas face to face together. TMEI2011 is very special for its strong organization team, dependable reputation and wide sponsors all around the world.

We are very sincere to invite you to take part in 2011 international conference on teaching materials, education and information technology (TMEI2011)in Wuhan, China. It will bring you an unexpected harvest. In the future, you may be a member of our big family. Therefore, it will a good chance for you to make friends in scholarism.All accepted papers will also be published on international journal Advanced Materials Research and it will be indexed by EI compendex and ISTP .Its ISSN is 1022-6680.Some excellent papers will be chosen to be published in some other journals, which will be indexed by SCI or EI.

所有被录用的文章将被出版在国际期刊Advanced Materials Research正刊上其ISSN 为1022-6680,，并被EI compendex检索。

Important Dates
第一卷第一期投稿截止时间：2011年1月20日
第二卷第二期投稿截止时间：2011年2月20日
第三卷第三期投稿截止时间：2011年4月1日
会议时间：2011年8月21-22日

Publication
After reviewing course, the accepted papers will be published on the international journalAdvanced Materials Researce which will be indexed by Elsevier and Ei compendex，ISI（ISTP,CPCI, Web of Science). The full text will be put online.

Indexing condition of Advanced Materials Researce：Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.
Call for Papers
2011 international conference on teaching materials, education and information technology (TMEI2011) will provide engineers, scientists, researchers with good chance to share their research findings inteaching materials, education and information technology fields. The conference will put its focus in the following aspects, but not limit them to:
The topics are as follows:

◆Teaching theory

◆Teaching management

◆Teaching methods

◆Teaching strategies

◆Teaching and learning

◆Autonomous learning

◆Teaching materials and its influence on education

◆Edition of teaching materials

◆Teaching materials and its reform

◆Teaching reform

◆Teaching and Multimedia

◆Teaching and information technology

◆Teaching and computer science

◆Knowledge discovering and data mining

◆Knowledge management

◆Data analysis and teaching

◆Examination and teaching

◆Evaluation and measure of education

◆Inform of education

◆Information engineering and education

◆Adult education

◆Education theory

◆Education and Acquisition

◆Education and control

◆Software engineering and education

◆Intelligent system and education

◆Digital design and education

◆Information and autonomous system

◆Information and robots

◆Information and soft science

◆Information technology in reliability, maintainability, testing, application of supportability, safety

◆Other topics

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