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【美国ASU博士招生】MEMS微系统, 先进半导体封装、光子集成｜全额资助 (长期有效)
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一、导师，课题组，和学校 导师：Hai Liu, Ph.D. Assistant Professor School of Electrical, Computer and Energy Engineering (ECEE) Ira A. Fulton Schools of Engineering, Arizona State University 课题组：HI-Micro Lab - Heterogeneous Integration & Microsystems Laboratory www.himicrolab.com HI-Micro Lab was founded by Dr. Hai Liu in the School of Electrical, Computer and Energy Engineering (ECEE) at Arizona State University (ASU). The lab focuses on MEMS, semiconductor packaging, heterogeneous integration, and photonics packaging and integration for next-generation high-performance computing, high-speed communications, and advanced sensing. Dr. Liu received his B.S. and M.S. degrees in Materials Science from Harbin Institute of Technology and his Ph.D. in Electrical Engineering from the University of Southern California (USC), where he conducted research on high-SNR MEMS microphones. Before joining ASU, he gained extensive industry experience in advanced packaging and integration of ICs, MEMS, and silicon photonics at Cisco, TDK InvenSense, and Samsung, with a strong track record in research and development. 学校：Arizona State University (ASU), located in Tempe near Phoenix, is an R1 research university ranked #1 in U.S. innovation for 11 consecutive years (2015–2026). Its engineering school ranks #32 nationally for undergraduate programs and #41 for graduate programs, while electrical engineering ranks #25 and #30, respectively. The Greater Phoenix area hosts a thriving semiconductor industry, including Intel, TSMC, Microchip, onsemi, Amkor, Applied Materials, and QCI, offering excellent opportunities for internships and career development. ASU embraces an inclusive environment and welcomes students from diverse backgrounds who are passionate about scientific and engineering research. 二、研究方向，招生对象，和资助 1. MEMS & Microsystems • High SNR MEMS Microphone • MEMS Ultrasonic Transducer • Optical MEMS 2. Advanced Semiconductor Packaging & Heterogeneous Integration • High density interconnection • 2.5D/3D Integration • Wafer-Level Packaging 3. Photonics Packaging and Integration • PIC – TFLN integration • PIC – Laser coupling • Optical interconnection HI-Micro Lab welcomes Ph.D. applicants interested in the research areas described above. Specific projects will be determined based on each student's academic background, research interests, and ongoing lab projects. All Ph.D. students will receive full funding covering tuition and living expenses. 希望招什么样的学生 • Interested in Ph.D. research and eager to explore scientific and engineering challenges. • Academic backgrounds: Electrical Engineering, Microelectronics, MEMS, Materials Science and Engineering, Mechanical Engineering, Physics, Acoustics, Optics, and related fields. • Self-motivated and capable of independent learning, critical thinking, and problem-solving, with a strong spirit of teamwork. • A solid foundation in mathematics, physics, and engineering. • Interested in cleanroom microfabrication and packaging processes, with strong hands-on skills. • Interested in interdisciplinary characterization and testing across materials, mechanical, electrical, optical, and acoustic domains. • Relevant research experience is preferred but not required. 如何申请 If you are interested in joining HI-Micro Lab, please email below materials to Professor Liu: hailiu@asu.edu： • Resume/CV • Transcripts • Statement of research interest  |
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