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【美国ASU博士招生】MEMS微系统, 先进半导体封装、光子集成｜全额资助 (长期有效)
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一、导师，课题组，和学校 导师：Hai Liu, Ph.D. Assistant Professor School of Electrical, Computer and Energy Engineering (ECEE) Ira A. Fulton Schools of Engineering, Arizona State University 课题组：HI-Micro Lab - Heterogeneous Integration & Microsystems Laboratory www.himicrolab.com HI-Micro Lab was founded by Dr. Hai Liu in the School of Electrical, Computer and Energy Engineering (ECEE) at Arizona State University (ASU). The lab focuses on MEMS, semiconductor packaging, heterogeneous integration, and photonics packaging and integration for next-generation high-performance computing, high-speed communications, and advanced sensing. Dr. Liu received his B.S. and M.S. degrees in Materials Science from Harbin Institute of Technology and his Ph.D. in Electrical Engineering from the University of Southern California (USC), where he conducted research on high-SNR MEMS microphones. Before joining ASU, he gained extensive industry experience in advanced packaging and integration of ICs, MEMS, and silicon photonics at Cisco, TDK InvenSense, and Samsung, with a strong track record in research and development. 学校：Arizona State University (ASU), located in Tempe near Phoenix, is an R1 research university ranked #1 in U.S. innovation for 11 consecutive years (2015–2026). Its engineering school ranks #32 nationally for undergraduate programs and #41 for graduate programs, while electrical engineering ranks #25 and #30, respectively. The Greater Phoenix area hosts a thriving semiconductor industry, including Intel, TSMC, Microchip, onsemi, Amkor, Applied Materials, and QCI, offering excellent opportunities for internships and career development. ASU embraces an inclusive environment and welcomes students from diverse backgrounds who are passionate about scientific and engineering research. 二、研究方向，招生对象，和资助 1. MEMS & Microsystems • High SNR MEMS Microphone • MEMS Ultrasonic Transducer • Optical MEMS 2. Advanced Semiconductor Packaging & Heterogeneous Integration • High density interconnection • 2.5D/3D Integration • Wafer-Level Packaging 3. Photonics Packaging and Integration • PIC – TFLN integration • PIC – Laser coupling • Optical interconnection HI-Micro Lab welcomes Ph.D. applicants interested in the research areas described above. Specific projects will be determined based on each student's academic background, research interests, and ongoing lab projects. All Ph.D. students will receive full funding covering tuition and living expenses. 希望招什么样的学生 • Interested in Ph.D. research and eager to explore scientific and engineering challenges. • Academic backgrounds: Electrical Engineering, Microelectronics, MEMS, Materials Science and Engineering, Mechanical Engineering, Physics, Acoustics, Optics, and related fields. • Self-motivated and capable of independent learning, critical thinking, and problem-solving, with a strong spirit of teamwork. • A solid foundation in mathematics, physics, and engineering. • Interested in cleanroom microfabrication and packaging processes, with strong hands-on skills. • Interested in interdisciplinary characterization and testing across materials, mechanical, electrical, optical, and acoustic domains. • Relevant research experience is preferred but not required. 如何申请 If you are interested in joining HI-Micro Lab, please email below materials to Professor Liu: hailiu@asu.edu： • Resume/CV • Transcripts • Statement of research interest  |
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中文版，欢迎感兴趣的同学联系 一、导师，课题组，和学校 导师：hai liu, ph.d. assistant professor school of electrical, computer and energy engineering (ecee) ira a. fulton schools of engineering, arizona state university 课题组：hi-micro lab - heterogeneous integration & microsystems laboratory www.himicrolab.com hi-micro lab 由刘海博士创立，隶属于美国亚利桑那州立大学（arizona state university, asu）电气、计算与能源工程学院（ecee）。课题组面向下一代高性能计算、光电互连，和先进传感系统，开展先进半导体封装、异质集成、电子/光子集成，以及 mems 微系统研究。刘教授本科和硕士毕业于哈尔滨工业大学材料科学与工程，博士毕业于南加州大学（usc）电子工程，博士期间从事高信噪比 mems 麦克风研究。加入 asu 前，曾在 cisco、tdk invensense、samsung semiconductor 等公司从事半导体芯片、mems 器件、及硅光子封装与集成研发，拥有丰富的半导体工业界研发经验和成果。 学校：asu位于亚利桑那tempe市，紧邻美国第五大城市菲尼克斯。asu属于美国r1研究型大学；工程学院本科排名全美#32（公立学校#18），研究生排名全美#41（公立学校#23）；电子工程专业本科排名全美#25，研究生排名全美#30。asu从2015-2026连续11年被评为美国学校创新#1。asu周边有顶级的半导体产业集群，包括intel, tsmc, mxp, microchip, on semi, amkor, applied materials, evg, qci, 等等，非常方便学生实习和找工作。asu实行inclusive的政策，具有极大的包容性，欢迎对科学和工程研究开发感兴趣的广大学子报名申请。 二、研究方向，招生对象，和资助 1. MEMS & Microsystems • 高信噪比MEMS Microphone • MEMS Ultrasonic Transducer • Optical MEMS 2. Advanced Semiconductor Packaging & Heterogeneous Integration • 高密度互连和先进键合 • 2.5D/3D Integration • Wafer-Level Packaging 2. Photonics Packaging and Integration • PIC & TFLN integration • PIC & Laser coupling • 光互连 hi-micro lab 诚招对以上研究方向感兴趣的博士生, 具体研究课题会结合学生的专业背景、研究兴趣以及实验室正在开展的项目进一步确定. 所有博士生都将获得学费和生活费的全额资助。 希望招什么样的学生 • 对博士研究感兴趣，愿意探索科学和工程问题 • 专业背景：电子工程，微电子，mems，材料科学与工程，机械工程，物理，声学，光学等 • 能够自我驱动去独立学习，思考，和解决问题，同时具有团队合作精神 • 有较好的数学，物理，和工程基础 • 对在cleanroom进行microfabrication和packaging工艺感兴趣，有较好的动手能力 • 对跨学科材料，机械，电子，光学，声学测试感兴趣 • 有相关研究经验者优先，但不是必须 如何申请 如果您感兴趣加入hi-micro lab, 请将以下材料发到刘教授邮箱 hailiu@asu.edu： • 个人简历 • 本科和硕士成绩单 • 研究兴趣说明 |
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