Znn3bq.jpeg
²é¿´: 5021  |  »Ø¸´: 38

winnyang3320

Ìú³æ (СÓÐÃûÆø)

[½»Á÷] ¡¾×ÊÔ´¡¿µç´ÅÆÁ±ÎµÄÒ»±¾Êé--Advanced Materials and Design for EMI shielding ÒÑÓÐ19È˲ÎÓë

Advanced Materials and Design for Electromagnetic Interference Shielding
                                                                              ----Xingcun Colin Tong

Electromagnetic compatibility (EMC) has been widely recognized as a part of electronic
design, especially since implementation of the EMC directive (89/336/EEC)
in 1992. National agencies in many countries have developed EMC standards and
regulations to minimize the problems caused by failure to deal with electromagnetic
interference (EMI). Historically, a concern about EMI can be dated back to military.
products in the 1930s. Since then great efforts have been made to develop EMI shielding
approaches. As digital devices appeared, EMI became a great concern. In the
1970s, problems associated with EMI and EMC design became an issue for products
that were beginning to be used within the commercial marketplace. EMC is now a
major factor in the design of all electrical products, and EMI shielding products have
been widely used in the military, aerospace industry, and commercial marketplaces.
With the development of EMC design and EMI shielding approaches, numerous
textbooks and articles have been published that cover all aspects of theoretical
physics related to EMC. However, comprehensive work devoted to the practicalities
of EMI shielding materials and design is rare. To meet the need in this area, this
book aims to comprehensively introduce the design guideline, materials selection,
characterization methodology, manufacturing technology, and future prospective of
EMI shielding. Chapter 1 gives the necessary overview of EMI shielding theory and
product design guideline. Chapter 2 is an extensive review of the characterization.
methodology of EMI shielding and materials used. Chapter 3 through Chapter 11
introduce particular EMI shielding materials and component designs, including
enclosures, metal-formed gaskets, conductive elastomer and flexible graphite components,
conductive foam and ventilation structures, board-level shielding materials,
composite materials and hybrid structures, absorber materials, grounding and cablelevel
shielding materials, and aerospace and nuclear shielding materials. Finally,
Chapter 12 presents a perspective of future trends in EMI shielding materials and
design.

ÇëÒªÏÂÔØµÄÅóÓÑ»ØÒ»ÏÂÌù£¬²¢ÆÀ¼Ûһϡ£¡£¡£

http://www.namipan.com/d/Advanced%20Materials%20and%20Design%20for%20EMI%20shielding.pdf/f5e57b72d331c9503b45f09888ab200a377399a0ebcca300

[ Last edited by winnyang3320 on 2009-11-18 at 11:49 ]
»Ø¸´´ËÂ¥

» ÊÕ¼±¾ÌûµÄÌÔÌûר¼­ÍƼö

ÌÔÌùÌÔ±¦

» ±¾ÌûÒÑ»ñµÃµÄºì»¨£¨×îÐÂ10¶ä£©

» ²ÂÄãϲ»¶

» ±¾Ö÷ÌâÏà¹Ø¼ÛÖµÌùÍÆ¼ö£¬¶ÔÄúͬÑùÓаïÖú:

ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû
»ØÌûÖ§³Ö ( ÏÔʾ֧³Ö¶È×î¸ßµÄǰ 50 Ãû )

shs-sps

½ð³æ (СÓÐÃûÆø)

¡ï
Сľ³æ(½ð±Ò+0.5):¸ø¸öºì°ü£¬Ð»Ð»»ØÌû½»Á÷
Â¥Ö÷£¬ÒѲ»ÄÜÏÂÁË£¬»¹ÓÐʲô°ì·¨¿ÉÒÔÏÂÔØµ½Âð£¿Ð»Ð»£¡
10Â¥2010-01-04 10:40:23
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû
ÆÕͨ»ØÌû

Nashcn

ľ³æ (СÓÐÃûÆø)

1

ºÃÌù£¬Ð»Ð»Â¥Ö÷
2Â¥2009-11-16 18:17:44
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

fdgudong

Ìú¸Ëľ³æ (ÕýʽдÊÖ)

1

лл¥Ö÷
fdgudong
3Â¥2009-11-17 16:33:35
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

saharafisher

½ð³æ (ÕýʽдÊÖ)

1

лл¥Ö÷

» ±¾ÌûÒÑ»ñµÃµÄºì»¨£¨×îÐÂ10¶ä£©

4Â¥2009-11-17 17:56:36
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

winnyang3320

Ìú³æ (СÓÐÃûÆø)

ÇëÇó¼Ó¾«¡£¡£¡£
5Â¥2009-11-17 21:26:17
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

winnyang3320

Ìú³æ (СÓÐÃûÆø)

×Ô¼º¶¥ÉÏÀ´
6Â¥2009-11-18 11:50:35
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

winnyang3320

Ìú³æ (СÓÐÃûÆø)

¶¥£¡£¡£¡
7Â¥2009-11-23 13:41:12
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

chenjin

Ìú¸Ëľ³æ (ÖøÃûдÊÖ)

·Ç³£µÄ¸Ðл  ºÃÊé

» ±¾ÌûÒÑ»ñµÃµÄºì»¨£¨×îÐÂ10¶ä£©

8Â¥2009-11-23 14:21:55
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

tianhuafeng

½ð³æ (ÕýʽдÊÖ)

¶àл¥Ö÷^_^
9Â¥2009-11-24 21:15:21
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû
Ïà¹Ø°æ¿éÌø×ª ÎÒÒª¶©ÔÄÂ¥Ö÷ winnyang3320 µÄÖ÷Ìâ¸üÐÂ
×î¾ßÈËÆøÈÈÌûÍÆ¼ö [²é¿´È«²¿] ×÷Õß »Ø/¿´ ×îºó·¢±í
[¿¼ÑÐ] »¯¹¤Ñ§Ë¶294·Ö£¬Çóµ¼Ê¦ÊÕÁô +33 yzyzx 2026-04-12 37/1850 2026-04-17 23:00 by wunaiy88
[¿¼ÑÐ] 260Çóµ÷¼Á +3 Zyt1314520.. 2026-04-17 4/200 2026-04-17 21:06 by Eurekall
[¿¼ÑÐ] 294Çóµ÷¼Á +7 µ­È»654321 2026-04-17 8/400 2026-04-17 16:36 by wutongshun
[¿¼ÑÐ] ÊÕµ½¸´ÊÔµ÷¼Áµ«ÊÇÈ¥²»ÁË +6 СÎÏÅ£* 2026-04-16 6/300 2026-04-17 10:05 by º­ÖñÁõ
[ÂÛÎÄͶ¸å] ÓÐûÓнÓÊձȽϿìµÄsciÆÚ¿¯Ñ½£¬×îºÃÔÚÒ»¸öÔÂÖ®Äڵģ¬ÑÐÈýº¢×ÓÇó±ÏÒµ 20+4 Ö®»¤×Å 2026-04-16 5/250 2026-04-17 10:02 by bobvan
[¿¼ÑÐ] 300Çóµ÷¼Á +11 ³Èa777 2026-04-15 11/550 2026-04-16 22:43 by cfdbai
[¿¼ÑÐ] »¯Ñ§070300 Çóµ÷¼Á +28 ¹þ¹þ¹þ^_^ 2026-04-12 28/1400 2026-04-16 21:36 by ´óÁ¦Ë®ÊÖÁ¦´óÎÞÇ
[¿¼ÑÐ] 307ÖÐÒ½¿¼Ñе÷¼Á +6 ÓÚÒÔ²ÉÞÀ 2026-04-14 6/300 2026-04-16 16:20 by qingfeng258
[¿¼ÑÐ] 085801µçÆø×¨Ë¶272Çóµ÷¼Á +19 µçÆøÀî 2026-04-13 21/1050 2026-04-15 13:37 by ºÚ¿Æ¼¼¿óÒµ
[¿¼ÑÐ] 366Çóµ÷¼Á +11 ²»ÖªÃûµÄСئ 2026-04-11 11/550 2026-04-14 15:50 by zs92450
[¿¼ÑÐ] ʳƷÓëÓªÑø£¨0955£©271Çóµ÷¼Á +15 Éý¸ñ°¢´ï 2026-04-12 16/800 2026-04-14 13:18 by ¸¡Èô_°²Éú
[¿¼ÑÐ] 085408¹âµçÐÅÏ¢¹¤³Ìר˶355Ò»Ö¾Ô¸³¤´º¹â»úËùµ÷¼Á +6 Íõymaa 2026-04-13 13/650 2026-04-14 11:33 by Íõymaa
[¿¼ÑÐ] 085600²ÄÁÏÓ뻯¹¤349·ÖÇóµ÷¼Á +16 Àîľ×Ó°¡¹þ¹þ 2026-04-12 17/850 2026-04-14 09:11 by fenglj492
[¿¼ÑÐ] 305Çóµ÷¼Á +8 Â꿨°Í¿¨boom 2026-04-11 8/400 2026-04-14 09:04 by pengliang8036
[¿¼ÑÐ] Çóµ÷¼Á +3 ÎÒ°®¸ßÊý¸ßÊý°®Î 2026-04-12 3/150 2026-04-14 01:00 by Íõ¬Bè±
[¿¼ÑÐ] 2026˶ʿµ÷¼Á_Äܶ¯_ºÓÄÏũҵ´óѧ +4 ºÓÄÏũҵ´óѧ-ÄÜ 2026-04-12 4/200 2026-04-13 22:01 by bljnqdcc
[¿¼ÑÐ] 293Çóµ÷¼Á +16 ÎÒ°®¸ßÊý¸ßÊý°®Î 2026-04-12 18/900 2026-04-13 21:47 by ѧԱJpLReM
[¿¼ÑÐ] 290Çóµ÷¼Á +18 ¿Â»´È» 2026-04-12 20/1000 2026-04-13 12:56 by cyh¡ª315
[¿¼ÑÐ] 0854µ÷¼Á +10 ³¤¹­°Á 2026-04-11 11/550 2026-04-13 10:38 by wp06
[¿¼ÑÐ] 344 ²ÄÁÏרҵ Çóµ÷¼Á211 ÎÞµØÓòÒªÇó +8 hualkop 2026-04-11 8/400 2026-04-12 22:24 by fqwang
ÐÅÏ¢Ìáʾ
ÇëÌî´¦ÀíÒâ¼û