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[½»Á÷] ÇóÖú£ºceramics international ÔõôÁªÏµ°¡

ÎÒǰ¶Îʱ¼äÏòceramics international ÓʼÄÁËһƪÎÄÕ£¬¿ÉÊÇÒѾ­¹ýÈ¥3¸öÔÂÁË£¬»¹ÊÇûÓÐÏûÏ¢£¬ÇëÎʸ÷λÕâÊÇÔõô»ØÊ°¡£¿»¹ÓÐÄÄλ֪µÀÔõôÁªÏµÆä±à¼­²¿Ñ¯ÎÊÇé¿ö°¡£¿Çë¸æÖªÎÒһϣ¬·Ç³£¸Ðл£¡
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¹ú¼ÊÌմɱ༭²¿(edit board)¾ßÌåÇé¿öÈçÏ¡£Äã¿ÉÒÔÁªÏµ×ܱ༭»ò¸ºÔð´¦ÀíÄãÎĸåµÄ±à¼­£¬Ñ¯ÎÊÎÄÕµÄÇé¿öºÍ״̬¡£
General Editor
P. Vincenzini
National Research Council, Faenza, Italy

Editors-in-Chief
J.F. Baumard
Ecole Nationale Sup¨¦rieure de C¨¦ramique Industrielle (ENSCI), Limoges Cedex, France

R.K. Bordia
University of Washington, Seattle, WA, USA

J. Gauckler
Eidgenössische Technische Hochschule Z¨¹rich (ETH), Zurich, Switzerland

J. Guo
Chinese Academy of Sciences (CAS), SHANGHAI, China

K. Koumoto
Nagoya University, Nagoya, Japan

R. Pampuch
AGH University of Science & Technology, Krakow, Poland



Editorial Board
D. Agrawal
Pennsylvania State University, University Park, PA, USA

A. Akbar
The Ohio State University, Columbus, OH, USA

R. Asthana
University of Wisconsin at Stout, Menomonie, WI, USA

J.P. Bennett
U.S. Department of Energy, Albany, OR, USA

P. Colombo
Universit¨¤ degli Studi di Padova, Padova, Italy

R. Danzer
Montanuniversität Leoben, Leoben, Austria

G. Fantozzi
I.N.S.A., Villeurbanne Cedex, France

P. Fauchais
Universit¨¦ de Limoges, Limoges Cedex, France

R. Fl¨¹kiger
Universit¨¦ de Gen¨¨ve, Geneve 4, Switzerland

R. Freer
The University of Manchester, Manchester, UK

W.L. Gladfelter
University of Minnesota, Minneapolis, MN, USA

Y. Gogotsi
Drexel University, Philadelphia, PA, USA

P. Greil
Friedrich-Alexander-Universität Erlangen-N¨¹rnberg, Erlangen, Germany

D. Guyomar
INSA de Lyon, Villeurbanne, France

K. Haberko
AGH University of Science & Technology, Krak¨®w, Poland

H.J. Hannink
CSIRO (The Commonwealth Scientific and Industrial Research Organization), Clayton, VIC, Australia

J.G. Heinrich
Technische Universität Clausthal-Zellerfeld, Clausthal, Germany

A. Kato
Fukuoka,

H-D. Kim
Korea Institute of Machinery and Materials, Gyeongnam, South Korea

S. Komarneni
Pennsylvania State University, University Park, PA, USA

W.E. Lee
Imperial College, London, UK

J. Lis
AGH University of Science & Technology, Krak¨®w, Poland

S. Mathur
Universität zu Köln, Köln, Germany

Y. Miyamoto
Toyo Tanso Co., Ltd, Osaka, Japan

M. Murakami
Shibaura Institute of Technology, Tokyo, Japan

R. Naslain
Domaine Universitaire, Pessac, France

T. Ogawa
Shizuoka University, Fukuroi, Japan

T. Ohji
National Institute of Advanced Industrial Science and Technology (AIST), Nagoya, Japan

G. Oprea
University of British Columbia, Vancouver, BC, Canada

H. Palmour III
Raleigh, NC, USA

A. Pierre
Universit¨¦ Claude Bernard - Lyon I, Villeurbanne, France

R.M. Pilliar
University of Toronto, Toronto, ON, Canada

J. Poirier
University of Orleans, Orleans, France

T.A. Prikhna
Ukrainian National Academy of Sciences (NAS), Kiev, Ukraine

R. Raj
University of Colorado at Boulder, Boulder, CO, USA

R. Reisfeld
Hebrew University of Jerusalem, Jerusalem, Israel

R. Riedel
Technische Universität Darmstadt, Darmstadt, Germany

S. Sano
National Institute of Advanced Industrial Science and Technology (AIST), Nagoya, Aichi, Japan

T. Sato
Tohoku University, Sendai, Japan

N. Setter
École Polytechnique F¨¦d¨¦rale de Lausanne (EPFL), Lausanne, Switzerland

V.I. Shevchenko
Russian Academy of Sciences, St. Petersburg, Russian Federation

W. Sigmund
University of Florida, Gainesville, FL, USA

M. Singh
NASA Glenn Research Center, Cleveland, OH, USA

V.K. Srivastava
Banaras Hindu University, Varanasi, India

C. Subbarrao
Tata Research Development and Design Centre, Pune, India

D. Tretyakov
M. V. Lomonosov Moscow State University, Moscow, Russian Federation

C. Vahlas
Centre Interuniversitaire de Recherche D'Ingenierie des Materiaux, Toulouse, France

O. Van der Biest
Katholieke Universiteit Leuven, Heverlee-Leuven, Belgium

J.A. Varela
Universidade Estadual Paulista (UNESP), Araraquara, Brazil

K. Watari
National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki, Japan

S. Wiederhorn
National Institute of Standards and Technology, Gaithersburg, MD, USA

D. Yan
Chinese Academy of Sciences (CAS), SHANGHAI, China

K.H. Yoon
Technische Universität Dresden, Dresden, Germany

W. Zhu
Nanyang Technological University, Singapore
8Â¥2009-11-13 14:47:28
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