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铁杆木虫 (正式写手)

应助: 35 (小学生)
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帖子: 479
在线: 711.6小时
虫号: 1932554
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专业: 有机高分子功能材料

[交流] 德国博士-功率半导体封装方向

德国博士机会，功率半导体封装方向，具体要求：

Industrial PhD Students in Advanced Cooling for Power Electronics，Germany
-Industrial PhD Students in Advanced Cooling for Power Electronics

-Industrial PhD Students in Advanced Cooling for Power Electronics
Main Responsibilities:
• Explore and analyze the current cooling technologies and insights (e.g. JET impingement or spray cooling, two phase cooling, micro-channel, etc.) for power electronics, while identify differences and opportunities for wide bandgap semiconductors
• Implement, test and evaluate thermal and fluid simulations for different novel cooling concepts
• Specify the optimal heat dissipation architecture for different power electronics at different application scenarios
• Clarify the design rules or application boundaries for different cooling concept/technologies
• Test vehicle prototyping and characterization, such as advanced joining process development, thermal Rth and reliability characterization
• Document your research results and publish them in leading international conferences and journals

Requirements:
• Master Degree in Power Electronics, Material Engineering, Applied Physics or similar field
• Strong knowledge of cooling for power electronics packaging including materials, structures, different application scenarios and failure mechanism in power electronic devices,
• Good understanding of thermal management, joining process and reliability testing
• Good understanding of mainstream thermal management simulation software
• Strong communication skills in English, fluent in Chinese or German would be a benefit
• Structured, well-organized and independent way of working with strong cross-functional team work ability

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