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zsdxwls铁杆木虫 (正式写手)
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德国博士-功率半导体封装方向
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德国博士机会，功率半导体封装方向，具体要求： Industrial PhD Students in Advanced Cooling for Power Electronics，Germany -Industrial PhD Students in Advanced Cooling for Power Electronics -Industrial PhD Students in Advanced Cooling for Power Electronics Main Responsibilities: • Explore and analyze the current cooling technologies and insights (e.g. JET impingement or spray cooling, two phase cooling, micro-channel, etc.) for power electronics, while identify differences and opportunities for wide bandgap semiconductors • Implement, test and evaluate thermal and fluid simulations for different novel cooling concepts • Specify the optimal heat dissipation architecture for different power electronics at different application scenarios • Clarify the design rules or application boundaries for different cooling concept/technologies • Test vehicle prototyping and characterization, such as advanced joining process development, thermal Rth and reliability characterization • Document your research results and publish them in leading international conferences and journals Requirements: • Master Degree in Power Electronics, Material Engineering, Applied Physics or similar field • Strong knowledge of cooling for power electronics packaging including materials, structures, different application scenarios and failure mechanism in power electronic devices, • Good understanding of thermal management, joining process and reliability testing • Good understanding of mainstream thermal management simulation software • Strong communication skills in English, fluent in Chinese or German would be a benefit • Structured, well-organized and independent way of working with strong cross-functional team work ability |
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4楼2024-07-04 01:36:04
zsdxwls
铁杆木虫 (正式写手)
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5楼2024-07-05 16:11:47
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