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Call for PhD and Post-Doctoral applications on Alpha Lab, Purdue University
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Call for PhD and Post-Doctoral applications on “Advanced Packaging and Thermal Packaging Management” – Alpha Lab, Purdue University Alpha Lab introduction "Alpha Lab" represents “All-in-one for Packaging, Heat transfer, and Assembly Lab”. Alpha Lab will mainly focus on advanced electronics packaging techniques, such as heterogeneous microsystem design and integration, including 2.5D and 3D ICs and packaging as well as activities with a focus on advanced thermal management techniques, such as smart-controlled cooling and efficient thermal packaging materials. We are looking for Ph.D. and Postdoc candidates who are interested in those topics, please feel free to send your CV with research projects and publications to tiwei32@stanford.edu. Research Background and topics Advanced semiconductor packaging is playing a crucial role to drive system performance and functionality. With the increasing demand for emerging and growing computing needs, heterogeneous three-dimensional (3D) integration with fine-pitch, high-density interconnections, and multi-chip stacks are very promising in the future. The aggressive interconnects pitch scaling and nanoscale via interconnections make the process development and reliability more and more challenging. On the other hand, this high-density 3D integration system has resulted in a substantial increase in both heat flux and power density (W/cm3). High-performance, energy-efficient thermal management solutions are needed to tackle this thermal challenge. The main focus of Alpha Lab is listed as below: 1.Addressing process integration and reliability challenges for fine-pitch, high-density advanced electronics packaging: Monolithic 3D Integration and Heterogeneous 2.5D interposer and 3D Integration. 2.Thermomechanical modeling and characterization of advanced devices and packages: chip package interactions, FEM modeling, and thermal stress measurements. 3."Smart microfluidic cooling system” with advanced manufacturing technologies using MEMS and 3D packaging: Active flow control for dynamic power profiles 4.Advanced heat sink design optimization and fabrication: Topology optimization and Additive manufacturing of the package level cooling system. 5.Advanced thermal materials: high thermal conductivity TIM (thermal interface materials), and underfill, thermal efficient 3D bonding interface. Application Requirements 1.Bachelor, Master or Ph.D. degree with Mechanical engineering, Electronic engineering or Materials Engineering, related to electronic packaging and thermal management. 2.Familiar with Semiconductor fabrication process and advanced electronic packaging technologies, Numerical modeling, Heat and mass transfer theory, CFD modeling, Fluid mechanics, Thermomechanical modeling and Thermodynamics. 3.Excellent GRE and TOEFL or IELTS test scores, good academic writing skill, and literature reading, oral presentation and communication skills. 4.Great teamwork, projects collaboration and self-learning abilities. Bio: Tiwei Wei is the incoming Assistant Professor at Purdue University, School of Mechanical Engineering, beginning July 2022. He is currently a postdoctoral research scholar in the NanoHeat lab at Stanford University. He received his Ph.D. degree in the 3D system integration department at Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020. He joined imec in 2015, starting the Ph.D. research with developing electronic cooling solutions for high-performance 3D systems. Before joining in imec, he worked as a researcher staff in Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where he worked on advanced microelectronic packaging techniques. His current research interests include impingement jet cooling and embedded microchannel cooling for heterogeneous 3D integration. He serves on the session chair and technical program committee of several electronic packaging conferences, including IEEE ESTC, REPP, 3DIC and EPTC. He is currently the vice-chair of IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter, with the mission to promote the education of local STEM students in the area of electronic packaging. |
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