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1.High critical electric field of thin silicon film and its realization in SOI high voltage devices
Hu, Shengdong ; Zhang, Bo; Li, Zhaoji Source: 2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC, 2008,
2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC

2. Quantificational dependence of vertical breakdown voltage on top silicon and dielectric layer thicknesses for SOI high voltage devices
Hu, Shengdong £»Li, Zhaoji; Zhang, Bo
Source: 2008 International Conference on Communications, Circuits and Systems Proceedings, ICCCAS 2008, p 1274-1277, 2008, 2008 International Conference on Communications, Circuits and Systems Proceedings, ICCCAS 2008

3. A new analytical model of high voltage silicon on insulator(SOI) thin film devices
Hu, Shengdong £»Zhang, Bo Li;  Zhaoji
sourece: Chinese physics B, vol 18 no.1 315-319
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Accession number:  20091412014969

Title:  High critical electric field of thin silicon film and its realization in SOI high voltage devices

Authors:  Hu, Shengdong1 ; Zhang, Bo1 ; Li, Zhaoji1  

Author affiliation:  1  State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, 610054, China


Corresponding author:  Hu, S. (hushengdong@hotmail.com)  

Source title:  2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC

Abbreviated source title:  IEEE Int. Conf. Electron Devices Solid-State Circuits, EDSSC

Monograph title:  2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC

Issue date:  2008

Publication year:  2008

Article number:  4760648

Language:  English

ISBN-13:  9781424425402

Document type:  Conference article (CA)

Conference name:  2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC

Conference date:  December 8, 2008 - December 10, 2008

Conference location:  Hong Kong, China

Conference code:  75769

Publisher:  Inst. of Elec. and Elec. Eng. Computer Society, 445 Hoes Lane - P.O.Box 1331, Piscataway, NJ 08855-1331, United States

Abstract:  Taking threshold energy ¦¥T into accounting for electron multiplying, the formula of silicon critical electric field ES,C is given as a function of silicon film thickness ts from an effective ionization rate aeff ES,C is increasing with the decreasing of ts especially at thinner ts 2-D simulative and some experimental results as well as the comparing with several other familiar expressions of electric field proved the proposed ES,C is valid for both thick and thin silicon film. Thin silicon film with high E S,C can be used to enhance dielectric field EI and increase vertical breakdown voltage VB.V of SOI high voltage devices. A high voltage SOI device with 80nm silicon layer and 0.4¦Ìm dielectric layer is designed. A high ES,C of 134V/¦Ìm is obtained, which makes EI and VB,V reach to 416 V/¦Ìm and 178V, respectively. © 2008 IEEE.

Number of references:  18

Main heading:  Solid state devices

Controlled terms:  DC generators  -  Dielectric properties  -  Electric conductivity  -  Electric field effects  -  Ionization of gases  -  Metallic films  -  Nonmetals

Uncontrolled terms:  Break down voltages  -  Critical electric fields  -  Dielectric fields  -  Dielectric layers  -  High voltage soi devices  -  High-voltage devices  -  Ionization rates  -  Silicon film thickness  -  Silicon layers  -  Thin silicon films   -  Threshold energies

Classification code:  804 Chemical Products Generally  -  802.2 Chemical Reactions  -  714.2 Semiconductor Devices and Integrated Circuits  -  708.1 Dielectric Materials  -  931.2 Physical Properties of Gases, Liquids and Solids  -  705.2.2 DC Generators  -  701 Electricity and Magnetism  -  539 Metals Corrosion and Protection; Metal Plating  -  531 Metallurgy and Metallography  -  701.1 Electricity: Basic Concepts and Phenomena

DOI:  10.1109/EDSSC.2008.4760648

Database:  Compendex

   Compilation and indexing terms, © 2009 Elsevier Inc.
4Â¥2009-08-28 15:43:20
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µÚÈýƪÎÄÕµÄEI¼ìË÷ºÅÊÇ£º20091311986323

-------------------------------------------------------------------------
Accession number:  20091311986323

Title:  A new analytical model of high voltage silicon on insulator (SOI) thin film devices

Authors:  Hu, Sheng-Dong1 ; Zhang, Bo1 ; Li, Zhao-Ji1  

Author affiliation:  1  State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China


Corresponding author:  Hu, S.-D. (hushengdong@hotmail.com)  

Source title:  Chinese Physics B

Abbreviated source title:  Chin. Phys.

Volume:  18

Issue:  1

Issue date:  2009

Publication year:  2009

Pages:  315-319

Language:  English

ISSN:  16741056

Document type:  Journal article (JA)

Publisher:  Institute of Physics Publishing, Temple Back, Bristol, BS1 6BE, United Kingdom

Abstract:  A new analytical model of high voltage silicon on insulator (SOI) thin film devices is proposed, and a formula of silicon critical electric field is derived as a function of silicon film thickness by solving a 2D Poisson equation from an effective ionization rate, with a threshold energy taken into account for electron multiplying. Unlike a conventional silicon critical electric field that is constant and independent of silicon film thickness, the proposed silicon critical electric field increases sharply with silicon film thickness decreasing especially in the case of thin films, and can come to 141 V/¦Ìm at a film thickness of 0.1 ¦Ìm which is much larger than the normal value of about 30V/¦Ìm. From the proposed formula of silicon critical electric field, the expressions of dielectric layer electric field and vertical breakdown voltage (VB,V) are obtained. Based on the model, an ultra thin film can be used to enhance dielectric layer electric field and so increase vertical breakdown voltage for SOI devices because of its high silicon critical electric field, and with a dielectric layer thickness of 2¦Ìm the vertical breakdown voltages reach 852 and 300V for the silicon film thicknesses of 0.1 and 5¦Ìm, respectively. In addition, a relation between dielectric layer thickness and silicon film thickness is obtained, indicating a minimum vertical breakdown voltage that should be avoided when an SOI device is designed. 2D simulated results and some experimental results are in good agreement with analytical results. © 2009 Chin. Phys. Soc. and IOP Publishing Ltd.

Number of references:  16

Main heading:  Semiconducting silicon compounds

Controlled terms:  Computer simulation  -  DC generators  -  Dielectric properties  -  Electric breakdown  -  Electric conductivity  -  Electric field effects  -  Electric field measurement  -  Electricity  -  Heterojunction bipolar transistors  -  Ionization of gases   -  Magnetic films  -  Metallic films  -  Molecular beam epitaxy  -  MOSFET devices  -  Nonmetals  -  Poisson equation  -  Thin film devices  -  Thin films

Uncontrolled terms:  Analytical models  -  Analytical results  -  Breakdown voltage  -  Dielectric layers  -  High voltages  -  Ionization rates  -  Silicon film thickness  -  Silicon films  -  Silicon on insulators  -  Simulated results   -  Soi devices  -  SOI high voltage device  -  Thin silicon layer  -  Threshold energies  -  Ultra-thin films

Classification code:  942.2 Electric Variables Measurements  -  714.2 Semiconductor Devices and Integrated Circuits  -  723.5 Computer Applications  -  802.2 Chemical Reactions  -  804 Chemical Products Generally  -  921.2 Calculus  -  931.2 Physical Properties of Gases, Liquids and Solids  -  931.3 Atomic and Molecular Physics  -  933.1.2 Crystal Growth  -  712.1.2 Compound Semiconducting Materials  -  531 Metallurgy and Metallography  -  539 Metals Corrosion and Protection; Metal Plating  -  701 Electricity and Magnetism  -  712.1 Semiconducting Materials  -  701.1 Electricity: Basic Concepts and Phenomena  -  708.1 Dielectric Materials  -  708.4 Magnetic Materials  -  705.2.2 DC Generators

DOI:  10.1088/1674-1056/18/1/051

Database:  Compendex

   Compilation and indexing terms, © 2009 Elsevier Inc.
3Â¥2009-08-28 14:55:28
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µÚÈýƪSCI: 000262494700051

FN ISI Export Format
VR 1.0
PT  J
AU  Hu, SD
Zhang, B
Li, ZJ
AF  Hu Sheng-Dong
Zhang Bo
Li Zhao-Ji
TI  A new analytical model of high voltage silicon on insulator (SOI) thin film devices
SO  CHINESE PHYSICS B
LA  English
DT  Article
DE  silicon critical electric field; breakdown voltage; thin silicon layer; SOI high voltage device
ID  P-N JUNCTIONS; AVALANCHE BREAKDOWN; LAYER
AB  A new analytical model of high voltage silicon on insulator (SOI) thin film devices is proposed, and a formula of silicon critical electric field is derived as a function of silicon film thickness by solving a 2D Poisson equation from an effective ionization rate, with a threshold energy taken into account for electron multiplying. Unlike a conventional silicon critical electric field that is constant and independent of silicon film thickness, the proposed silicon critical electric field increases sharply with silicon film thickness decreasing especially in the case of thin films, and can come to 141 V/mu m at a film thickness of 0.1 mu m which is much larger than the normal value of about 30 V/mu m. From the proposed formula of silicon critical electric field, the expressions of dielectric layer electric field and vertical breakdown voltage (V-B,V- V) are obtained. Based on the model, an ultra thin film can be used to enhance dielectric layer electric field and so increase vertical breakdown voltage for SOI devices because of its high silicon critical electric field, and with a dielectric layer thickness of 2 mu m the vertical breakdown voltages reach 852 and 300V for the silicon film thickness of 0.1 and 5 mu m, respectively. In addition, a relation between dielectric layer thickness and silicon film thickness is obtained, indicating a minimum vertical breakdown voltage that should be avoided when an SOI device is designed. 2D simulated results and some experimental results are in good agreement with analytical results.
C1  [Hu Sheng-Dong; Zhang Bo; Li Zhao-Ji] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China.
RP  Hu, SD, Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China.
EM  hushengdong@hotmail.com
FU  National Natural Science Foundation of China [60436030]; National Laboratory of Analogue Integrated Circuits, China [914C090305060C09]
FX  Project supported by the National Natural Science Foundation of China (Grant No 60436030) and National Laboratory of Analogue Integrated Circuits, China (Grant No 914C090305060C09).
NR  16
TC  0
PU  IOP PUBLISHING LTD
PI  BRISTOL
PA  DIRAC HOUSE, TEMPLE BACK, BRISTOL BS1 6BE, ENGLAND
SN  1674-1056
J9  CHIN PHYS B
JI  Chin. Phys. B
PD  JAN
PY  2009
VL  18
IS  1
BP  315
EP  319
PG  5
SC  Physics, Multidisciplinary
GA  395AP
UT  ISI:000262494700051
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