| 查看: 4177 | 回复: 7 | |||
[交流]
Immediate Reject，前前后后不到10小时，水平问题？ 已有5人参与
|
| 投了下TII，前前后后不到十个小时就收到Immediate Reject。可能师兄和老板为了鼓励我，说不是水平问题。大佬们帮忙看看这个到底是因为什么？ |
回复此楼» 猜你喜欢
材料专硕(0856) 339分求调剂
已经有7人回复
-
081700学硕，323分，一志愿中国海洋大学求调剂学校
已经有15人回复
-
295求调剂
已经有10人回复
-
一志愿9材料学硕297已过六级求调剂推荐
已经有10人回复
-
312求调剂
已经有3人回复
-
一志愿北京化工085600 310分求调剂
已经有12人回复
-
一志愿 南京航空航天大学 ，080500材料科学与工程学硕
已经有8人回复
-
工科277分求调剂材料
已经有5人回复
-
电子信息调剂交叉学科有推荐吗
已经有9人回复
-
材料工程专硕求调剂
已经有11人回复
|
Thank you for submitting your manuscript " xxxxxxxxxxxxxxx" for possible publication in the IEEE Transactions on Industrial Informatics (TII). Although your manuscript is of interest and technical merit, I regret to inform you that we will not be able to consider your manuscript in its present form for TII. In order to deal with the large number of submissions to TII in a timely manner, all the manuscripts we receive are initially screened by the Editor-in-Chief and/or Associate Editors. Given the fact that TII can publish only a small fraction of the manuscripts received each year, we decide carefully through an early stage of the reviewing process which papers are likely to be suitable for publishing in TII after comprehensive peer-review. We understand you may be disappointed by this decision, but hope that our rapid response will enable you to pursue other options without undue delay. Thank you again for the opportunity for us to read your manuscript. We hope that you will consider submitting your work to TII again in the future. With kind regards, |
2楼2021-05-31 13:19:09
3楼2021-05-31 13:23:13
做工业系统异常检测和根因定位的，之前看到TII发过差不多方向的，实在是找不到特别符合的Trans了 4楼2021-05-31 13:29:33
★
小木虫: 金币+0.5, 给个红包，谢谢回帖
小木虫: 金币+0.5, 给个红包，谢谢回帖
|
本帖内容被屏蔽 |
5楼2021-05-31 14:24:57
6楼2021-05-31 14:58:17
ibaojr
木虫 (知名作家)
土鳖
- 应助: 226 (大学生)
- 金币: 3437.3
- 散金: 3832
- 红花: 28
- 帖子: 5119
- 在线: 702.9小时
- 虫号: 397318
- 注册: 2007-06-09
- 性别: GG
- 专业: 通信理论与系统
其实，你只要大量引用这个杂志的引文，就估计没问题，直接可以进入评审环节了。试试看，多引用几篇投稿杂志发表的论文为引文
7楼2021-06-02 19:37:04
littleyellow
金虫 (小有名气)
- 应助: 0 (幼儿园)
- 金币: 1023.2
- 红花: 3
- 帖子: 206
- 在线: 889.4小时
- 虫号: 7310055
- 注册: 2017-10-16
- 专业: 高分子组装与超分子结构
8楼2021-06-04 10:47:28
