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只要翻译好，20金币赠与一人，参与者均有金币，除使用翻译软件者
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| 另一种研究较多的焊锡(solder)回收方法是机械分拆法(Mechanical separation methods), 该方法一般是采用热风或液态加热介质或者其它发热体使焊锡熔化，然后在机械振动、冲击、热风吹扫或真空吸力等外力作用下使焊锡从废弃印刷电路板(WPCBs)上分离回收。 |
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★ ★
210jiejie(金币+2,VIP+0):谢谢参与 6-30 08:27
210jiejie(金币+2,VIP+0):谢谢参与 6-30 08:27
| another well investigated method to recycle the solder is mechanical separation method, which is characterized by melting the solder in hot air or liquid environment followed by separating the molten solder from WPCBs via mechanical vibration, impaction, hot air blowing or vacuum suction. |
2楼2009-06-30 06:52:28
coretta(金币+0,VIP+0):请不要用翻译软件！！ 6-30 08:31
| Another study of more solder (solder) is mechanical recovery spin-off method (Mechanical separation methods), the method is generally used in liquid heating or hot air or other heating medium body so that molten solder, and then in the mechanical vibration, impact, hot air Purge or vacuum suction under external force, such as solder from waste printed circuit boards (WPCBs) on the separation and recovery. |
3楼2009-06-30 08:11:20
★ ★
hongweiwei000(金币+2,VIP+0):谢谢，欢迎常来 7-1 11:24
hongweiwei000(金币+2,VIP+0):谢谢，欢迎常来 7-1 11:24
| Another recycling method for solder that has been much studied is Mechanical separation methods which always use hot wind or liquid heating material or melt the solder by other heating object, then separate and recycle the solder from WPCBs under the mechanic vibrant, impact, hot wind blow and the external force and so on. |
4楼2009-06-30 08:37:07
monitor2885
至尊木虫 (职业作家)
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210jiejie(金币+2,VIP+0):谢谢参与 6-30 10:44
hongweiwei000(金币+3,VIP+0):翻译的不错，欢迎常来 7-1 11:23
210jiejie(金币+2,VIP+0):谢谢参与 6-30 10:44
hongweiwei000(金币+3,VIP+0):翻译的不错，欢迎常来 7-1 11:23
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另一种研究较多的焊锡(solder)回收方法是机械分拆法(Mechanical separation methods), 该方法一般是采用热风或液态加热介质或者其它发热体使焊锡熔化，然后在机械振动、冲击、热风吹扫或真空吸力等外力作用下使焊锡从废弃印刷电路板(WPCBs)上分离回收。 Mechanical separation methods was considered as another pop method to recycle solder, that generally made solder melted resorting to hot air, heating medium in liquid or other glowing materials, and then recycled solder from waste printed circuit boards (WPCBs) after series of external forces introduced, such as mechanical vibration, impact, hot air blowing or vacuum suction, etc.  [ Last edited by monitor2885 on 2009-6-30 at 10:38 ] |
5楼2009-06-30 10:36:15
monitor2885
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6楼2009-06-30 13:44:19
7楼2009-07-01 08:45:26
8楼2009-07-01 09:19:55
monitor2885
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9楼2009-07-01 09:29:00