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[交流] 【2009-4-27】2009 International Conference (ICEPT-HDP)

2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

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附件下载网址：
http://www.cinn.cc/viewfile.php?f_id=168

CONFERENCE THEMES
You are invited to submit an abstract, describing new development in the following themes:
 Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.
 High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-joint, HDI substrate, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.
 Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.
 Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.
 Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.
    Packaging Equipment & Advanced Manufacturing Technologies: New packaging/assembly equipment; packaging equipment/measurement techniques for emerging technologies; photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.
 Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.

IMPORTANT DATES
 April 27, 2009 – Deadline for Submission of Abstract
 May 08, 2009 – Notification of Acceptance
 July 13 , 2009 – Deadline for Submission of Manuscript

SUBMISSION OF ABSTRACT/PAPER
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions, and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file to  icept2009@tsinghua.edu.cn.
The abstracts must be received by April 27, 2009. Authors must include their affiliations, mailing addresses, telephone and fax numbers, and email addresses. Authors will be notified of paper acceptance by May 08, 2009. The final manuscripts for publication in the conference proceedings are due by July 13, 2009. Selected papers will be recommended for publication in IEEE/CPMT journals.

CALL FOR EXHIBITION/SPONSORSHIP
A tabletop exhibition featuring suppliers of materials, equipment, components and software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may email icept2009@tsinghua.edu.cn for details.

[ Last edited by dmfang on 2009-4-13 at 18:48 ]

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