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ghalex

银虫 (小有名气)

应助: 0 (幼儿园)
金币: 649
帖子: 84
在线: 29.6小时
虫号: 578797
注册: 2008-07-04
性别: GG
专业: 集成电路制造与封装

[交流] 【求助】请教ansys中Boolean操作错误的解决办法，谢谢

MCM热传分析的ansys程序如下，问题是：为什么最后模型Boolean操作的时候选择vglue,all出错，选择vovlap,all也出错误？不理解。

请教各位了，谢谢

/units,si
/filename,mcm02
/title,3d thermal simulation of multichip module
!定义中间大芯片的尺寸
*set,D1_length,8e-3
*set,D1_width,8e-3
*set,D1_height,0.65e-3
!定义周围小芯片的尺寸
*set,D2_length,5e-3
*set,D2_width,5e-3
*set,D2_height,0.65e-3
!定义大芯片下凸点的尺寸和数量
*set,SB1_Radius,0.15e-3
*set,SB1_Dist,0.75e-3
*set,SB1_Nb,10
*set,SB1_Height,0.2e-3
*set,SB1_Side,0.625e-3
!定义小芯片下凸点的尺寸和数量
*set,SB2_Radius,0.15e-3
*set,SB2_Dist,0.75e-3
*set,SB2_Nb,6
*set,SB2_Height,0.2e-3
*set,SB2_Side,0.625e-3
!定义基板的尺寸
*set,Sub_Length,40e-3
*set,Sub_Width,40e-3
*set,Sub_Height,1.5e-3
!定义基板下焊料球的尺寸和数量
*set,SB3_Radius,0.3e-3
*set,SB3_Dist,1.27e-3
*set,SB3_Nb,26
*set,SB3_Height,0.4e-3
*set,SB3_Side,4.125e-3
!定义大小芯片之间的中心距
*set,D_Dist,11.5e-3
!定义PCB的尺寸
*set,PCB_Length,100e-3
*set,PCB_Width,100e-3
*set,PCB_Height,1.5e-3
!定义热扩展面的尺寸
*set,Hs_Length,40e-3
*set,Hs_Width,40e-3
*set,Hs_Thick,1.5e-3
!定义粘接剂的厚度
*set,Sa_Height,0.15e-3
!定义热介质材料的厚度
*set,Tim_Height,0.15e-3
!定义热沉的尺寸
*set,Sink_Length,46.5e-3
*set,Sink_Width,46.5e-3
*set,Sink_Height,1.5e-3
*set,Pin_Nb,16
*set,Pin_Height,8e-3
*set,Pin_Thick,1.5e-3
*set,Pin_Dist,1.5e-3

!进入前处理器，定义实体单元类型为Solid70
/prep7
Et,1,Solid70
!定义材料参数
MP,Kxx,1,1.82 !芯片
MP,Kxx,2,36 !芯片凸点
MP,Kxx,3,0.2 !基板
MP,Kxx,4,50 !基板下焊料球
MP,Kxx,5,8.37 !PCB板
MP,Kyy,5,8.37 !
MP,Kzz,5,0.32 !
MP,Kxx,6,390 !热扩散面Cu
MP,Kxx,7,1.1 !粘接剂
MP,Kxx,8,8.1 !热介质材料
MP,Kxx,9,240 !热沉
!建立几何模型
/Pnum,Volu,1
!PCB板模型
Block,0,PCB_Length/2,0,PCB_Width/2,0,PCB_Height
!建立基板下焊料及基板的模型
!焊料球是鼓状的，可通过overlap命令重叠球体和长方体来获得
!先建立一个鼓装的焊料球，其余通过VGEN命令复制生成
Wpoff,SB3_Dist/2,SB3_Dist/2,PCB_Height+SB3_Height/2
SPHERE,SB3_Radius, ,0,360
!偏移工作平面至基板的左下角，并建立基板模型
Wpoff,-SB3_Dist/2,-SB3_Dist/2,SB3_Height/2
Block,0,Sub_Length/2,0,Sub_Width/2,0,Sub_Height
!重叠基板，焊球和PCB模型
Vovlap,all
Numcmp,all
Csys,0
Vsel,S,Loc,z,0,PCB_Height
Vadd,all
Csys,4
Vsel,S,Loc,z,0,Sub_Height
Vadd,all
! 根据z坐标范围来选择刚才建立的基板下焊球
Vsel,S,Loc,z,0,-SB3_Height
!往X方向复制
Vgen,SB3_Nb/2,All,,,SB3_Dist,,,,0
Vsel,S,Loc,z,0,-SB3_Height
!往Y方向复制
Vgen,SB3_Nb/2,all,,,,SB3_Dist,,,0
Numcmp,All
!建立芯片下凸点及芯片的模型
!同样，凸点也是鼓状的，也需通过overlap命令重叠球体和长方体来获得
!同样先在每个芯片下建立一个鼓状的焊料球，其余也可通过Vgen命令复制生成
Wpoff,SB1_Dist/2,SB1_Dist/2,Sub_Height+SB1_Height/2
Sphere,SB1_Radius,,0,360
Wpoff,-SB1_Dist/2,-SB1_Dist/2,SB1_Height/2
Block,0,D1_Length/2,0,D1_Width/2,0,D1_Height
Block,0,D2_length/2,D_Dist-D2_Width/2,D_Dist+D2_Width/2,0,D2_Height
Block,D_Dist-D2_length/2,D_Dist+D2_Length/2,0,D2_Width/2,0,D2_Height

Wpoff,D_Dist-D2_Length/2+SB2_Side,SB2_Dist/2,-SB2_Height/2
SPhere,SB2_Radius,,0,360
Wpoff,-(D_Dist-D2_Length/2+SB2_Side),-SB2_Dist/2,
Wpoff,SB2_Dist/2,D_Dist-D2_Width/2+SB2_Side
SPhere,SB2_Radius,,0,360
Wpoff,-SB2_Dist/2,-(D_Dist-D2_Width/2+SB2_Side),SB2_Height/2
Vsel,S,Loc,Z,-(SB1_Height+Sub_Height),D1_Height
Vovlap,all
Numcmp,all
Vsel,S,Loc,Z,-(SB1_Height+Sub_Height),-SB1_Height
Vadd,All
Numcmp,all
Vsel,S,Loc,Z,0,D1_Height
Vadd,all
Numcmp,all
!大芯片下焊料球
Vsel,S,Loc,X,0,D1_Length/2
Vsel,R,Loc,y,0,D1_Width/2
Vsel,R,Loc,z,0,-SB1_Height
Vgen,SB1_Nb/2,all,,,,SB1_Dist,,,0
Vsel,S,Loc,X,0,D1_Length/2
Vsel,R,Loc,y,0,D1_Width/2
Vsel,R,Loc,z,0,-SB1_Height
Vgen,SB1_Nb/2,all,,,SB1_Dist,,,,0
!小芯片下焊料球
Vsel,S,Loc,x,D_Dist-D2_Length/2,D_Dist+D2_Length/2
Vsel,R,Loc,y,0,D2_Width/2
Vsel,R,Loc,z,0,-SB2_Height
Vgen,SB2_Nb,All,,,SB2_Dist,,,,0
Vsel,S,Loc,x,D_Dist-D2_Length/2,D_Dist+D2_Length/2
Vsel,R,Loc,y,0,D2_Width/2
Vsel,R,Loc,z,0,-SB2_Height
Vgen,SB2_Nb/2,All,,,,SB2_Dist,,,0
!小芯片下焊料球
Vsel,S,Loc,x,0,D2_Length/2
Vsel,R,Loc,y,D_Dist-D2_Width/2,D_Dist+D2_Width/2
Vsel,R,Loc,z,0,-SB2_Height
Vgen,SB2_Nb/2,All,,,SB2_Dist,,,,0
Vsel,S,Loc,x,0,D2_Length/2
Vsel,R,Loc,y,D_Dist-D2_Width/2,D_Dist+D2_Width/2
Vsel,R,Loc,z,0,-SB2_Height
Vgen,SB2_Nb,All,,,,SB2_Dist,,,0
!建立芯片上热介质材料模型
Wpoff,0,0,D1_Height
Block,0,D1_Length/2,0,D1_Width/2,0,Tim_Height
Block,0,D2_Length/2,D_Dist-D2_Width/2,D_Dist+D2_Width/2,0,Tim_Height
Block,D_Dist-D2_Length/2,D_Dist+D2_Length/2,0,D2_Width/2,0,Tim_Height

!建立热扩展面（CU）模型
wpoff,0,0,Tim_Height
Block,0,Hs_Length/2,0,Hs_Width/2,0,HS_Thick
*set,Hs_Height,Tim_Height+D1_Height+SB1_Height-SA_Height
Block,0,Sub_Length/2,Sub_Width/2-Hs_Thick,Sub_Width/2,0,-Hs_Height
Block,Sub_Length/2-Hs_Thick,Sub_Length/2,0,Sub_Width/2-Hs_thick,0,-Hs_Height
!建立基板上粘接剂的模型
Wpoff,0,0,-(Tim_Height+D1_Height+SB1_Height)
Block,0,Sub_Length/2,Sub_Width/2-Hs_Thick,Sub_Width/2,0,SA_Height
Block,Sub_Length/2-Hs_Thick,Sub_Length/2,0,Sub_Width/2-Hs_Thick,0,Sa_height
!建立热沉的模型
Wpoff,0,0,Tim_Height+D1_Height+SB1_Height+Hs_Thick
Block,0,Sub_Length/2,0,Sub_Width/2,0,Tim_Height
Block,0,Sink_Length/2,0,Sink_Width/2,Tim_Height,Tim_height+Sink_Height
Wpoff,0,0,Tim_Height+Sink_Height
Block,Sink_Length/2-Pin_Thick,Sink_Length/2,0,Sink_Width/2,0,Pin_Height
Vsel,S,Loc,z,0,Pin_Height
Vgen,Pin_Nb/2,all,,,-(Pin_Dist+Pin_Thick),,,,0
!通过overlao将PCB分为两部分，方便结构规则的部分进行sweep网络划分
Csys,0
Wpave,0,0,0
Csys,4
Block,0,Sub_Length/2,0,Sub_Width/2,0,PCB_Height
Vsel,S,Loc,Z,0,PCB_Height
Vovlap,all
Numcmp,all
vsel,all
vglue,all

[ Last edited by kuhailangyu on 2009-3-26 at 15:52 ]

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