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【求助】请教ansys中Boolean操作错误的解决办法，谢谢
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MCM热传分析的ansys程序如下，问题是：为什么最后模型Boolean操作的时候选择vglue,all出错，选择vovlap,all也出错误？不理解。 请教各位了，谢谢 /units,si /filename,mcm02 /title,3d thermal simulation of multichip module !定义中间大芯片的尺寸 *set,D1_length,8e-3 *set,D1_width,8e-3 *set,D1_height,0.65e-3 !定义周围小芯片的尺寸 *set,D2_length,5e-3 *set,D2_width,5e-3 *set,D2_height,0.65e-3 !定义大芯片下凸点的尺寸和数量 *set,SB1_Radius,0.15e-3 *set,SB1_Dist,0.75e-3 *set,SB1_Nb,10 *set,SB1_Height,0.2e-3 *set,SB1_Side,0.625e-3 !定义小芯片下凸点的尺寸和数量 *set,SB2_Radius,0.15e-3 *set,SB2_Dist,0.75e-3 *set,SB2_Nb,6 *set,SB2_Height,0.2e-3 *set,SB2_Side,0.625e-3 !定义基板的尺寸 *set,Sub_Length,40e-3 *set,Sub_Width,40e-3 *set,Sub_Height,1.5e-3 !定义基板下焊料球的尺寸和数量 *set,SB3_Radius,0.3e-3 *set,SB3_Dist,1.27e-3 *set,SB3_Nb,26 *set,SB3_Height,0.4e-3 *set,SB3_Side,4.125e-3 !定义大小芯片之间的中心距 *set,D_Dist,11.5e-3 !定义PCB的尺寸 *set,PCB_Length,100e-3 *set,PCB_Width,100e-3 *set,PCB_Height,1.5e-3 !定义热扩展面的尺寸 *set,Hs_Length,40e-3 *set,Hs_Width,40e-3 *set,Hs_Thick,1.5e-3 !定义粘接剂的厚度 *set,Sa_Height,0.15e-3 !定义热介质材料的厚度 *set,Tim_Height,0.15e-3 !定义热沉的尺寸 *set,Sink_Length,46.5e-3 *set,Sink_Width,46.5e-3 *set,Sink_Height,1.5e-3 *set,Pin_Nb,16 *set,Pin_Height,8e-3 *set,Pin_Thick,1.5e-3 *set,Pin_Dist,1.5e-3 !进入前处理器，定义实体单元类型为Solid70 /prep7 Et,1,Solid70 !定义材料参数 MP,Kxx,1,1.82 !芯片 MP,Kxx,2,36 !芯片凸点 MP,Kxx,3,0.2 !基板 MP,Kxx,4,50 !基板下焊料球 MP,Kxx,5,8.37 !PCB板 MP,Kyy,5,8.37 ! MP,Kzz,5,0.32 ! MP,Kxx,6,390 !热扩散面Cu MP,Kxx,7,1.1 !粘接剂 MP,Kxx,8,8.1 !热介质材料 MP,Kxx,9,240 !热沉 !建立几何模型 /Pnum,Volu,1 !PCB板模型 Block,0,PCB_Length/2,0,PCB_Width/2,0,PCB_Height !建立基板下焊料及基板的模型 !焊料球是鼓状的，可通过overlap命令重叠球体和长方体来获得 !先建立一个鼓装的焊料球，其余通过VGEN命令复制生成 Wpoff,SB3_Dist/2,SB3_Dist/2,PCB_Height+SB3_Height/2 SPHERE,SB3_Radius, ,0,360 !偏移工作平面至基板的左下角，并建立基板模型 Wpoff,-SB3_Dist/2,-SB3_Dist/2,SB3_Height/2 Block,0,Sub_Length/2,0,Sub_Width/2,0,Sub_Height !重叠基板，焊球和PCB模型 Vovlap,all Numcmp,all Csys,0 Vsel,S,Loc,z,0,PCB_Height Vadd,all Csys,4 Vsel,S,Loc,z,0,Sub_Height Vadd,all ! 根据z坐标范围来选择刚才建立的基板下焊球 Vsel,S,Loc,z,0,-SB3_Height !往X方向复制 Vgen,SB3_Nb/2,All,,,SB3_Dist,,,,0 Vsel,S,Loc,z,0,-SB3_Height !往Y方向复制 Vgen,SB3_Nb/2,all,,,,SB3_Dist,,,0 Numcmp,All !建立芯片下凸点及芯片的模型 !同样，凸点也是鼓状的，也需通过overlap命令重叠球体和长方体来获得 !同样先在每个芯片下建立一个鼓状的焊料球，其余也可通过Vgen命令复制生成 Wpoff,SB1_Dist/2,SB1_Dist/2,Sub_Height+SB1_Height/2 Sphere,SB1_Radius,,0,360 Wpoff,-SB1_Dist/2,-SB1_Dist/2,SB1_Height/2 Block,0,D1_Length/2,0,D1_Width/2,0,D1_Height Block,0,D2_length/2,D_Dist-D2_Width/2,D_Dist+D2_Width/2,0,D2_Height Block,D_Dist-D2_length/2,D_Dist+D2_Length/2,0,D2_Width/2,0,D2_Height Wpoff,D_Dist-D2_Length/2+SB2_Side,SB2_Dist/2,-SB2_Height/2 SPhere,SB2_Radius,,0,360 Wpoff,-(D_Dist-D2_Length/2+SB2_Side),-SB2_Dist/2, Wpoff,SB2_Dist/2,D_Dist-D2_Width/2+SB2_Side SPhere,SB2_Radius,,0,360 Wpoff,-SB2_Dist/2,-(D_Dist-D2_Width/2+SB2_Side),SB2_Height/2 Vsel,S,Loc,Z,-(SB1_Height+Sub_Height),D1_Height Vovlap,all Numcmp,all Vsel,S,Loc,Z,-(SB1_Height+Sub_Height),-SB1_Height Vadd,All Numcmp,all Vsel,S,Loc,Z,0,D1_Height Vadd,all Numcmp,all !大芯片下焊料球 Vsel,S,Loc,X,0,D1_Length/2 Vsel,R,Loc,y,0,D1_Width/2 Vsel,R,Loc,z,0,-SB1_Height Vgen,SB1_Nb/2,all,,,,SB1_Dist,,,0 Vsel,S,Loc,X,0,D1_Length/2 Vsel,R,Loc,y,0,D1_Width/2 Vsel,R,Loc,z,0,-SB1_Height Vgen,SB1_Nb/2,all,,,SB1_Dist,,,,0 !小芯片下焊料球 Vsel,S,Loc,x,D_Dist-D2_Length/2,D_Dist+D2_Length/2 Vsel,R,Loc,y,0,D2_Width/2 Vsel,R,Loc,z,0,-SB2_Height Vgen,SB2_Nb,All,,,SB2_Dist,,,,0 Vsel,S,Loc,x,D_Dist-D2_Length/2,D_Dist+D2_Length/2 Vsel,R,Loc,y,0,D2_Width/2 Vsel,R,Loc,z,0,-SB2_Height Vgen,SB2_Nb/2,All,,,,SB2_Dist,,,0 !小芯片下焊料球 Vsel,S,Loc,x,0,D2_Length/2 Vsel,R,Loc,y,D_Dist-D2_Width/2,D_Dist+D2_Width/2 Vsel,R,Loc,z,0,-SB2_Height Vgen,SB2_Nb/2,All,,,SB2_Dist,,,,0 Vsel,S,Loc,x,0,D2_Length/2 Vsel,R,Loc,y,D_Dist-D2_Width/2,D_Dist+D2_Width/2 Vsel,R,Loc,z,0,-SB2_Height Vgen,SB2_Nb,All,,,,SB2_Dist,,,0 !建立芯片上热介质材料模型 Wpoff,0,0,D1_Height Block,0,D1_Length/2,0,D1_Width/2,0,Tim_Height Block,0,D2_Length/2,D_Dist-D2_Width/2,D_Dist+D2_Width/2,0,Tim_Height Block,D_Dist-D2_Length/2,D_Dist+D2_Length/2,0,D2_Width/2,0,Tim_Height !建立热扩展面（CU）模型 wpoff,0,0,Tim_Height Block,0,Hs_Length/2,0,Hs_Width/2,0,HS_Thick *set,Hs_Height,Tim_Height+D1_Height+SB1_Height-SA_Height Block,0,Sub_Length/2,Sub_Width/2-Hs_Thick,Sub_Width/2,0,-Hs_Height Block,Sub_Length/2-Hs_Thick,Sub_Length/2,0,Sub_Width/2-Hs_thick,0,-Hs_Height !建立基板上粘接剂的模型 Wpoff,0,0,-(Tim_Height+D1_Height+SB1_Height) Block,0,Sub_Length/2,Sub_Width/2-Hs_Thick,Sub_Width/2,0,SA_Height Block,Sub_Length/2-Hs_Thick,Sub_Length/2,0,Sub_Width/2-Hs_Thick,0,Sa_height !建立热沉的模型 Wpoff,0,0,Tim_Height+D1_Height+SB1_Height+Hs_Thick Block,0,Sub_Length/2,0,Sub_Width/2,0,Tim_Height Block,0,Sink_Length/2,0,Sink_Width/2,Tim_Height,Tim_height+Sink_Height Wpoff,0,0,Tim_Height+Sink_Height Block,Sink_Length/2-Pin_Thick,Sink_Length/2,0,Sink_Width/2,0,Pin_Height Vsel,S,Loc,z,0,Pin_Height Vgen,Pin_Nb/2,all,,,-(Pin_Dist+Pin_Thick),,,,0 !通过overlao将PCB分为两部分，方便结构规则的部分进行sweep网络划分 Csys,0 Wpave,0,0,0 Csys,4 Block,0,Sub_Length/2,0,Sub_Width/2,0,PCB_Height Vsel,S,Loc,Z,0,PCB_Height Vovlap,all Numcmp,all vsel,all vglue,all [ Last edited by kuhailangyu on 2009-3-26 at 15:52 ] |
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2楼2009-03-27 00:08:17
