[交流] Silver Metallization: Stability and Reliability

Springer | ISBN: 184800026X | 2007-12-10 | PDF | 123 pages Silver has the lowest resistivity of all metals, which makes it anattractive interconnect material for higher current densities andfaster switching speeds in integrated circuits. Over the past tenyears, extensive research has been conducted to address the thermal andelectrical stability, as well as processing issues which, to date, haveprevented the implementation of silver as an interconnect metal. SilverMetallization: Stability and Reliability is the first book to discusscurrent knowledge of silver metallization and its potential as afavorable candidate for implementation as a future interconnectmaterial for integrated circuit technology.                       Silver Metallization: Stability and Reliability provides detailedinformation on a wide range of experimental, characterization andanalysis techniques. It also presents the novel approaches used toovercome the thermal and electrical stability issues associated withsilver metallization. Readers will learn about the:                       * preparation and characterization of elemental silver thin films and silver-metal alloys;                       * formation of diffusion barriers and adhesion promoters; * evaluation of the thermal stability of silver under different annealing conditions;               * evaluation of the electrical properties of silver thin films under various processing conditions;             * methods of dry etching of silver lines and the integration of silverwith low-k dielectric materials.                       As a valuable resource in this emerging field; Silver Metallization:Stability and Reliability will be very useful to students, scientists,engineers and technologists in the fields of integrated circuits andmicroelectronics research and development. http://depositfiles.com/en/files/6b2iry4w3 [ Last edited by lihai0910 on 2009-1-5 at 11:31 ]

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