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[交流] [2017-03-10]The 14th IEEE International Conference on Ubiquitous Intelligence an

会议城市:
旧金山
是否Ei/ISTP收录:
Ei收录
截稿日期:
2017年3月10日

1. Introduction
Ubiquitous sensors, devices, networks and information are paving the way towards a smart world in which computational intelligence is distributed throughout the physical environment to provide reliable and relevant services to people. This ubiquitous intelligence will change the computing landscape because it will enable new breeds of applications and systems to be developed and the realm of computing possibilities will be significantly extended. By enhancing everyday objects with intelligence, many tasks and processes could be simplified, the physical spaces where people interact like the workplaces, homes or cities, could become more efficient, safer and more enjoyable. Ubiquitous computing is to create such intelligent/smart environments, services and applications.

Research on ubiquitous intelligence is an emerging research field covering many disciplines. A series of grand challenges exist to move from the current level of computing services to the ubiquitous intelligent/smart things. UIC 2017 is the next edition of the successful series, previously held as UIC 2016 Toulouse France, UIC 2015 Beijing China, UIC 2014 Bali Indonesia, UIC 2013 Vietri sul Mare Italy, UIC 2012 Fukuoka Japan, UIC 2011 Banff Canada, UIC 2010 Xi'an China, UIC 2009 Brisbane Australia, UIC 2008 Oslo Norway, UIC 2007 Hong Kong, UIC 2006 Wuhan China, UIC 2005 Nagasaki Japan, and UIC 2004 Taipei.

The 14th IEEE International Conference on Ubiquitous Intelligence and Computing (UIC 2017) will include a highly selective program of technical papers, accompanied by workshops, demos, panel discussions and keynote speeches. We welcome high quality papers that describe original and unpublished research advancing the state of the art in ubiquitous intelligence and computing.

2. Organizing Committee
Organizing Committee
Honorary Chairs
•   Sumi Helal, University of Florida, USA

General Chairs
•   Liming Chen, De Montfort University, U.K.
•   Marie-Pierre Gleizes, University of Toulouse, France

General Executive Chairs
•   Didier El Baz, LAAS-CNRS, France
•   Zeyu Gao, San Jose State University, USA

Program Chairs
•   Guanling Chen, University of Massachusetts Lowell, USA

Program Co-Chairs
•   Yasha Wang, Beijing University, China
•   Amit K. Pandey, SoftBank Robotics, France
•   Bing Wang, University of Connecticut, USA

Workshop and Special Session Chairs
•   Hui Yu, Portsmouth University, UK
•   Haoyi Xiong, Missouri University of Sci. and Tech., USA

Poster and Demo Chairs
•   Xiang Ding, Akamai, USA
•   Sarah Fallmann, De Montfort University, UK

Publicity Chairs
•   Jiaqi Gong, University of Virginia, USA
•   Joseph Rafferty, Ulster University, UK
•   Chao Chen, Chongqing University, China

Journal Special Issue Chairs
•   Jianwu Wang, University Maryland Baltimore County, USA
•   Dongpu Cao, Cranfield University, UK

Web Publication Chairs
•   Zihao Jiang, St. Francis Xavier University, Canada
•   Sazzad Hussain, St. Francis Xavier University, Canada

Registration Chair
•   Xuan Guan, San Jose State University, USA

Local Organisation Chair
•   Sam Zhang, San Jose State University, USA

Steering Committee
•   Jianhua Ma (Chair), Hosei University, Japan
•   Laurence T. Yang (Chair), St. Francis Xavier University, Canada
•   Sumi Helal, University of Florida, USA
•   Daqing Zhang, Institut Telecom SudParis, France
•   Jadwiga Indulska, University of Queensland, Australia
•   Theo Ungerer, University of Augsburg, Germany
•   Bernady O. Apduhan, Kyushu Sangyo University, Japan

3. Important Dates
Workshop/Special Session Proposal Due, January 30, 2017
Paper Submission Deadline, March 10, 2017
Authors Notification, May 10, 2017
Camera-ready & Registration, June 10, 2017

4. Link
https://ieee-smartworld.org/2017/uic/[ Last edited by 杈杈 on 2016-12-29 at 08:52 ]

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  • 附件 1 : UIC2017_CFP_final.pdf
  • 2016-12-27 22:54:07, 489.35 K
  • 附件 2 : UIC-2017-Call-for-Workshop-Session-final.pdf
  • 2016-12-27 22:54:13, 97.01 K

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