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»áÒéÃû³Æ£¨ÖÐÎÄ£©£º 2009 IEEE»úµçÒ»Ì廯Óë×Ô¶¯»¯¹ú¼Ê»áÒé
»áÒéÃû³Æ£¨Ó¢ÎÄ£©£º The 2009 IEEE International Conference on Mechatronics and Automation (ICMA 2009)
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Ö÷°ìµ¥Î»£º IEEE£¬³¤´ºÀí¹¤´óѧ£¬ÈÕ±¾Ïã´¨´óѧ
Э°ìµ¥Î»£º Öйú¹ú¼Ò×ÔÈ»»ù½ðί£¬½ÌÓý²¿£¬Öйú»úе¹¤³Ìѧ»á£¬Öйú×Ô¶¯»¯Ñ§»á£¬ÈÕ±¾»úÆ÷ÈËѧ»á£¬ÈÕ±¾»úеѧ»á£¬¹þ¶û±õ¹¤³Ì´óѧ£¬µç×ӿƼ¼´óѧ£¬±±¾©¹¤Òµ´óѧ£¬¼ªÁÖ´óѧ
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ÒéÌ⣺ Intelligent mechatronics
robotics
biomimetics
automation and control systems  
opto-electronic elements and Materials
laser technology and laser processing  
Elements
structures
mechanisms
and applications of micro and nano systems
Teleoperation
telerobotics
haptics
and teleoperated semi-autonomous systems
Sensor design
multi-sensor data fusion algorithms and wireless sensor networks
Biomedical and rehabilitation engineering
prosthetics and artificial organs
Control system modeling and simulation techniques and methodologies
AI
intelligent control
neuro-control
fuzzy control and their applications
Industrial automation
process control
manufacturing process and automation

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»áÒéÖ÷ϯ£º Prof.Toshio Fukuda & Prof.Shuxiang Guo
×é֯ίԱ»áÖ÷ϯ£º ÓÚ»¯¶« ½ÌÊÚ£¬³¤´ºÀí¹¤´óѧУ³¤
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2009-5-15
½»ÐÞ¶©°æ½ØÖ¹ÈÕÆÚ£º 2009-6-1
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ÁªÏµÈË£º Prof.Shuxiang Guo
ÁªÏµµç»°£º +81-87-864-2333
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E-mail£º guo@eng.kagawa-u.ac.jp;icma2009@cust.edu.cn
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»áÒéÍøÕ¾£º http://www.ieee-icma.org/
»áÒé±³¾°½éÉÜ£º The 2009 IEEE International Conference on Mechatronics and Automation (ICMA 2009) will take place in Changchun, Jilin, China from August 9 to August 12, 2009. A renowned ancient city in China, Changchun is situated in northeastern China. As the capital of Jilin province, Changchun is known as the cradle of new China's automobile industry, optoelectronics technology and biological technology, applied chemistry and so on. It ranks predominantly China in terms of the research and development on optics, exactitude apparatus, laser technique, macromolecule material,biological products, super conduct and automobile, etc.
As the host city of ICMA 2009, Changchun not only provides the attendees with a great venue for this event, but also an unparallel experience in Chinese history and culture. You are cordially invited to join us at IEEE ICMA 2009 in Changchun to live this unique experience.

Contributed Papers: All papers must be submitted in PDF format prepared strictly following the IEEE PDF Requirements for Creating PDF Documents for IEEE Xplore®. The standard number of pages is 6 and the maximum page limit is 8 pages with extra payment for the two extra pages. See detailed instructions in the conference web site. All paper accepted by IEEE ICMA 2009 will be indexed by EI and included in IEEE Xplore®.

Õ÷ÎÄ·¶Î§¼°ÒªÇó£º The objective of ICMA 2009 is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of mechatronics, robotics, automation and sensors to disseminate their latest research results and exchange views on the future research directions of these fields. The topics of interest include, but not limited to the following:


- Intelligent mechatronics, robotics, biomimetics, automation and control systems  
- opto-electronic elements and Materials, laser technology and laser processing  
- Elements, structures, mechanisms, and applications of micro and nano systems
- Teleoperation, telerobotics, haptics, and teleoperated semi-autonomous systems
- Sensor design, multi-sensor data fusion algorithms and wireless sensor networks
- Biomedical and rehabilitation engineering, prosthetics and artificial organs
- Control system modeling and simulation techniques and methodologies
- AI, intelligent control, neuro-control, fuzzy control and their applications
- Industrial automation, process control, manufacturing process and automation

All papers must be submitted in PDF format prepared strictly following the IEEE PDF Requirements for Creating PDF Documents for IEEE Xplore®. The standard number of pages is 6 and the maximum page limit is 8 pages with extra payment for the two extra pages. See detailed instructions in the conference web site. All paper accepted by IEEE ICMA 2009 will be indexed by EI and included in IEEE Xplore®.


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