| 查看: 1161 | 回复: 10 | ||
| 【奖励】 本帖被评价6次,作者返求诸己增加金币 5.5 个 | ||
| 当前主题已经存档。 | ||
| 当前只显示满足指定条件的回帖,点击这里查看本话题的所有回帖 | ||
[资源]
《《Semiconductor Material and Device Characterization》》
|
||
|
Semiconductor Material and Device Characterization By Dieter K. Schroder Publisher: Wiley-IEEE Press Number Of Pages: 800 Publication Date: 2006-01-30 Sales Rank: 211190 ISBN / ASIN: 0471739065 EAN: 9780471739067 Binding: Hardcover Manufacturer: Wiley-IEEE Press Studio: Wiley-IEEE Press Average Rating: 5 This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department. Review: Essential text This is an essential text for engineers, scientists, and graduate students working in the semiconductor field. It contains a thorough review of all major electrical, optical, and physical characterization methods that are commonly used. Descriptions of techniques are generally conceptually oriented, clearly stated, and do not rely excessively on equations. In addition, many useful figures are included to help explain concepts when introduced. Up to date references are included for essentially every technique mentioned. Review: Great reference Schroder has compiled an extensive and very nearly complete guide to modern characterization techniques that apply mostly to semiconductors and solid state devices, but also to techniques used in general materials analysis. We used this text in a graduate level course in EE and found it easy to read through and concise for use as a quick reference. Well worth the money. Review: Semiconductor Material and Device Characterization This book offers an outstanding review of various techniques of semiconductor device processing. It is the type of book that is an invaluable reference to the device engineer. It's breadth is outstanding.pass: gigapedia.org http://mihd.net/jlr8ag http://rapidshare.com/files/6390 ... tion_0471739065.rar |
» 猜你喜欢
青椒八年已不青,大家都被折磨成啥样了?
已经有11人回复
限项规定
已经有9人回复
免疫学博士有名额,速联系
已经有4人回复
交叉科学部支持青年基金,对三无青椒是个机会吗?
已经有5人回复
国家基金申请书模板内插入图片不可调整大小?
已经有6人回复
国家级人才课题组招收2026年入学博士
已经有5人回复
Fe3O4@SiO2合成
已经有6人回复
青年基金C终止
已经有4人回复
26申博求博导推荐-遥感图像处理方向
已经有4人回复
西南交通大学国家级人才团队2026年博士研究生招生(考核制)—机械、材料、力学方向
已经有3人回复
4楼2008-11-16 21:50:29
3楼2008-11-16 20:46:36
6楼2008-12-03 09:27:30













回复此楼