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[资源]
无铅焊料互连可靠性（英文版）
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无铅焊料互连可靠性 Lead-free Solder Interconnect Reliability  Author(s): Dongkai Shangguan Year: 2005 Edition: illustrated edition Language: English Pages: 292 This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. This is the first book dedicated specifically to this topic, which is of paramount importance to the electronics industry. The coverage is focused primarily on tin-silver-copper and tin-copper eutectic (or near eutectic) alloys, the primary lead-free solder alloys being adopted by the worldwide electronics industry.  |
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2015-03-03 16:34:37, 14.29 M
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