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[资源] Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
By James J. Licari, Dale W. Swanson

Publisher: William Andrew Publishing
Number Of Pages: 460
Publication Date: 2005-07-15
ISBN-10 / ASIN: 0815515138
ISBN-13 / EAN: 9780815515135
Binding: Hardcover

This second book in the Materials and Processes for Electronic Applications Series (James J. Licari, ed.) is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as U.V., microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Each book in the Materials and Processes for Electronic Applications Series provides theoretical foundations and practical data useful to electronics design engineers, process engineers, manufacturing engineers, quality assurance and reliability engineers, materials scientists, and polymer chemists as they strive to achieve ever more demanding electronics product features. These interdisciplinary books bridge gaps between electronics engineers and materials engineers important in advancing the state of the art. Applications cover the major industries: automotive, medical, semiconductors, space, and military.

Summary: Industry guru shares the location of the secret elephant burial ground
Rating: 5

I thought I knew everything about adhesives for electronics, but this book covers everything and then some. A must have for industry professionals

Summary: Getting stuck with the right adhesives.
Rating: 5

"Adhesives Technology for Electronic Applications" is the first book dedicated exclusively to the electronic applications of adhesives. It leaves no need for another such book, at least until this generation gives way to nano or other adhesives. It is many books in one: textbook, handbook, reference book, catalog, history book. Together, all exhaustively cover the what, why, and how of electronics adhesives.

First, the history traces the development of adhesives for electronics assembly through four generations, beginning in the 1960's, revealing the problems encountered and solved as adhesive chemistry grew more sophisticated.

The textbook follows, providing the physics and chemistry foundations in a theory of how adhesives work. The four main functions of electronics adhesives, adhesion, electrical conductivity, heat transfer, and stress control, are examined sequentially. The chemistry chapter details the formulations and properties of eight major adhesive families used in electronics. For the chemically competent, this may be a well-structured refresher.

Past these textbook underpinnings, the handbook/catalog begins with the chapter on bonding manufacturing processes. This longest chapter (93 pages, 25 tables) follows the factory production flow, from pre-cleaning to final curing, and, alas, rework. Material, equipment, and processes are extensively covered, both with tables of generic information and examples of commercial products and their features, by supplier and model number.

The reference book takes a different useful viewpoint, examining all the major adhesive end-use applications. It illustrates how different requirements logically lead to different adhesive solutions. The message is clear: in the world of adhesives, one size doesn't fit all.

The concluding two chapters, on reliability and on testing, are a logical pair, sharing tables of specifications, test methods, and examples of test results. One useful table lists the sources for many government and commercial specifications and standards.

Overall, the book judiciously mixes clear explanations with extensive tabular information and more than 400 literature references. Having no index to the 76 tables is a minor annoyance. However, frequent users will no doubt bookmark their most-used tables

I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both.

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