24小时热门版块排行榜

返回列表

当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖

radicle

银虫 (小有名气)

应助: 3 (幼儿园)
金币: 284.8
帖子: 58
在线: 121.4小时
虫号: 2286442

[交流] [2014-08-22]SCI: IJDSN Special Issue: Big Data on Future Sensing

截稿日期:

2014年8月22日

SCI期刊特刊，Open Access，整体命中率64%，审稿快速，有什么问题都可以联系编辑具体询问，回复及时

CFP地址 http://www.hindawi.com/journals/ijdsn/si/619063/cfp/

Big Data in Future Sensing
Call for Papers

With the exponential increasing number of data generating devices, such as computers, smart phones, tablets, and sensors, the vast amount of data to be processed, i.e., “Big Data,” has become an important concern. The utilization of big data is transforming science, engineering, medicine, healthcare, finance, business, and ultimately the whole society. This special issue provides a leading forum for disseminating the latest research in big data research, development, and applications in future sensing. We solicit high-quality original research papers (including surveys and reviews) in sensing aspect of big data with emphasis on 5Vs (Volume, Velocity, Variety, Value, and Veracity) big data science and foundations, big data infrastructure, big data management, big data searching and mining, big data privacy/security, and big data applications in sensing. Potential topics include, but are not limited to:

Novel theoretical and computational models for big data in future sensing
Novel data model and database technology for emerging hardware (e.g., sensor devices and smartphones)
Search and learning on big data based on sensing
Scalable and efficient architectures, protocols, and algorithms for big data in future sensing
Web applications and mobile applications on big data collected from sensor networks
Security and privacy issues on big data in future sensing
Applying sensing data in crowdsourcing and social applications
Virtualization of sensing data
Sensing of big multimedia data
Big data processing in sensor networks (e.g., storage, reliability, and on-site processing)
Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ijdsn/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijdsn/bd/ according to the following timetable:

Manuscript Due Friday, 22 August 2014
First Round of Reviews Friday, 14 November 2014
Publication Date Friday, 9 January 2015
Lead Guest Editor

Ting Zhu, Department of Computer Science, Binghamton University, Binghamton, NY, USA
Guest Editors

Qingquan Zhang, Lemko Corporation, Itasca, IL, USA
Sheng Xiao, Hunan University, Hunan, China
Yu Gu, Singapore University of Technology and Design, Singapore
Ping Yi, Shanghai Jiaotong University, Shanghai, China
Yanhua Li, Noah’s Ark Lab, Hong Kong

[ Last edited by 杈杈 on 2014-7-26 at 23:25 ]

回复此楼