北京石油化工学院2026年研究生招生接收调剂公告
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怡然宁静

铁杆木虫 (正式写手)

[交流] TISD2010 extended paper submisssion deadline

Dear Prospective Delegates



The 3rd Technology and Innovation for Sustainable Development International Conference (TISD 2010) will be held March 4 - 6, 2010 at Royal Mekong Nongkhai Hotel, Nong Khai, Thailand.



As requested by many authors, the submission deadline of TISD 2010 is extended to 21st December. You are welcome to submit your papers in all fields of Science and Technology. For more information, please visit http://www.en.kku.ac.th/tisd2010



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TISD2010 : The 3rd Technology and Innovation for Sustainable  Development International Conference.

DATE : March 4 - 6, 2010

VENUE : Royal Mekong Nongkhai Hotel, Nong Khai, Thailand

PAPER SUBMISSION DATELINE : 21 December 2009

TOPICS : Science and Technology in general (Please see the website)

WEBSITE : http://www.en.kku.ac.th/tisd2010

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The Faculty of Engineering- Khon Kaen University, The Engineering  Institute of Thailand Under H.M. The King’s Patronage(Northeastern   Region Branch), Agricultural Machinery and Postharvest Technology  Research Center, Research Center for Environment and Hazardous  Substance Management, Sustainable Infrastructure Research and  Development Center, Industry/University Cooperative Research Center in  Hard Disk Drive Component, Center for Alternative Energy Research and  Development- Khon Kaen University (AERD-KKU), Energy Management and  Conservation Office (EMCO) and Khon Kaen University will be hosting  The 3rd Technology and Innovation for Sustainable Development  Conference, also referred to as “TISD2010”. TISD2010 is the  international conference and will be held at the Royal Mekong Nongkhai  Hotel, Nong Khai, Thailand during March 4 - 6, 2010.



TISD2010 will provide an excellent opportunity for active and dynamic  science and engineering researchers from the academic, public and  private sectors all over the world to exchange and disseminate new  knowledge, research experiences and professional expertise, and create  linkages among the participants for mutual benefits.







Best Regards

TISD 2010 Organizing Committee

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