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分类 共搜索到 22 个相关话题(最多显示前5000个) 作者 最后发表
文献求助 求文献
marshinfo'.1.'][info2]Foodpackaging-roles，materialsandenvironmentalissuesinfo'.2.'][info3]Foodscienceinfo'.3.'][info4]2007info'.4.'][info5]1-5info'.5.'][info6]...
 lewenff 2017-10-27 02:14
文献求助 Transmit/Receive Module Packaging:Electrical Design Issues
[info2]Transmit/ReceiveModulePackaging:ElectricalDesignIssuesinfo'.2.'][info3]JohnsHopkinsAplTechnicalDigestinfo'.3.'][info4]1999info'.4.'][info5]20,70-80info...
 huangdme 2017-09-04 02:14
博后之家 Postdoctoral position on viral nanoshells at University ...
Singlestranded(ss)RNAvirusesaremajorpublichealthissues(e.g.hepatitisC,Dengue,andZika...aimsatelucidatingthedynamicpathwaysofgenomepackagingintoicosahedral...
 chenjingzhi 2017-06-19 11:35
电化学 packaging issues
投超级电容器文章时，编辑提到packagingissues，这个是什么意思？是说实验中电容器组装过程出现的问题或者是电容器实际应用中的包装问题呢？
 lavender0524 2017-04-19 01:33
文献求助 求助外文文献一篇
[info1]ShujiTanakainfo'.1.'][info2]Wafer-levelhermeticMEMSpackagingbyanodicbondinganditsreliabilityissuesinfo'.2.'][info3]MicroelectronicsReliabilityinfo'.3.'...
 lucas1860 2017-03-13 02:51
会议与征稿布告栏 【2017-1-2】【EI&ISTP推荐SCI】2017年第二届计算智能和通信技术...
System-on-a-ChipDesign-SystemIssuesinComplexity,LowPower,HeatDissipation-PowerAwarenessin...SignalDesignandAnalysis-Electrical/PackagingCo-DesignINTERDISCIPLINARY&...
 sjkcz183 2017-01-02 01:14
会议截稿子版 【2017-1-2】【EI&ISTP推荐SCI】2017年第二届计算智能和通信技术...
System-on-a-ChipDesign-SystemIssuesinComplexity,LowPower,HeatDissipation-PowerAwarenessin...SignalDesignandAnalysis-Electrical/PackagingCo-DesignINTERDISCIPLINARY&...
 maafb88 2016-12-26 01:36
会议与征稿布告栏 【2017-1-2】【EI&ISTP推荐SCI】2017年第二届计算智能和通信技术...
System-on-a-ChipDesign-SystemIssuesinComplexity,LowPower,HeatDissipation-PowerAwarenessin...SignalDesignandAnalysis-Electrical/PackagingCo-DesignINTERDISCIPLINARY&...
 大米——大米 2016-11-18 12:06
会议与征稿布告栏 【2016-12-25】【EI&ISTP推荐SCI】2017年第二届计算智能和通信...
System-on-a-ChipDesign-SystemIssuesinComplexity,LowPower,HeatDissipation-PowerAwarenessin...SignalDesignandAnalysis-Electrical/PackagingCo-DesignINTERDISCIPLINARY&...
 大米——大米 2016-11-17 02:44
科研资料 Microsystems and Nanotechnology——周兆杰 王中林 林立伟主编
IssuesforMicrosystemsChapter4NanopiezotronicsandNanogeneratorsChapter5Electron...NanophotonicsChapter11IntroductiontoMEMSPackagingPart3：Nanotechnology...
 学海浪子 2016-10-15 08:35
文献求助 求文献，有链接
electromagneticisolationissuesamongmulti-chipsinsysteminpackageinfo'.2.'][info3]ElectronicPackagingTechnology(ICEPT),201415thInternationalConferenceoninfo'.3....
 xiaozi1 2016-07-13 04:42
文献求助 文献求助
simulationandexperimentalvalidationoffan-outtypewaferlevelpackagingsubjectedtodropimpactinfo'.2.'][info3]...48,Issues8–9,Pages1149–1154info'.5.']
 mysu 2016-05-19 07:04
招聘信息布告栏 QA Manager
covernewissues.1.5Managequalityinformationanddata1.6ObtainISO9001accreditation2....packagingspecifications2.5ManageQCactivities:labQC,inspectionoffinal...
 sahalasanmao 2016-03-30 07:19
招聘信息布告栏 QA Manager
covernewissues.1.5Managequalityinformationanddata1.6ObtainISO9001accreditation2....packagingspecifications2.5ManageQCactivities:labQC,inspectionoffinal...
 sahalasanmao 2016-03-21 06:47
版块工场 电机世界交流帖
TransactionsonCommunicationsIEEETransactionsonComponents,PackagingandManufacturing...ExergyInternationalJournalofGlobalEnergyIssuesInternationalJournalof...
 curton 2016-01-29 08:46
绿色求助(高悬赏) 求助ELSEVIER数据库的Analytica Chimica Acta期刊中文献一篇
Biancottoainfo'.1.'][info2]Apackagingcontaminant:Isopropylthioxanthone(ITX)indairyproductsinfo'....[info4]2008info'.4.'][info5]Volume617,Issues1–2,9June2008,Pages...
 yamei0926 2015-12-18 03:52
招聘信息布告栏 【美资500强 Life Science BU】招聘Quality Manager-苏州吴江
andissues.Servesasthecustomeradvocateintheplant.Collaborateswithplantanddivision...irradiation(Gamma&E-Beam)andpackagingcompanies?ASQC(AmericanSociety...
 天使依敏 2015-12-09 08:33
文献求助 期刊论文
powerdevicepackaginginfo'.2.'][info3]MicroelectronicsReliabilityinfo'.3.'][info4]2006info'.4.'][info5]Volume46,Issues9–11,September–November2006,Pages1932–1937...
 xing446 2015-10-29 05:31
文献求助 IEEE
[info1]Boettge,B.info'.1.'][info2]Packagingmaterialissuesinhightemperaturepowerelectronicsinfo'.2.'][info3]ieeeinfo'.3.'][info4]2013info'.4.'][info5]1-6info'....
 xing446 2015-10-24 07:08
文献求助 求助Microelectronics Journal文献一篇
engineeringofoptoelectronicpackagingmaterials:dielectricconstantmodelinginfo'.2.'][info3]...[info4]2002info'.4.'][info5]Volume33,Issues5–6,Pages409-415info'.5.']...
 vespala 2015-10-16 04:59
信息科学 EEIC 2011_I.C.Electric and Electronics(Ei,ISTP)
paperstoEE2011,addressingissuesthatservepresentandfuturedevelopmentofthefield.Circuits...CircuitsAssemblyandPackagingTestandReliabilityAdvancedTechnologies...
 conanwj 2011-03-19 03:02
信息科学 CDMMS 2011_I.C.Computer-aided Design,Manufacturing,Modeling&...
developmentincludingtechnicalchallenges,socialandeconomicissues,andtopresentand...?AdvancedPackaging&System?IntelligentandAdaptiveControl??Simulation...
 conanwj 2011-03-16 12:00