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分类	共搜索到 1880 个相关话题(最多显示前5000个)	作者	最后发表

文献求助	Filled-Waveguide-Based Extraction and Package-Level ... AhmetMuratYagci;BerkayCiftci;MahmutSamiYazici;AliIlkerIsik;SelimAcarFilled-Waveguide-BasedExtractionandPackage-LevelValidationofUnderfillLossTangentformm-WaveFlip-...	张俊pcb	2026-07-06 04:12
文献求助	Edge diffraction of in-duct modal waves by unflanged or ... XiaoJingandZhaohuiDuEdgediffractionofin-ductmodalwavesbyunflangedorflangedcircularductterminationsJournalofFluidMechanics,Volume103410May2026,A3310May2026,A33...	张俊pcb	2026-07-06 02:47
文献求助	Ray-acoustic modeling of reflection at terminations of open-... XiaoJingORCIDlogoa),ZhaohuiDuRay-acousticmodelingofreflectionatterminationsofopen-endedcircularducts:ValidationagainstWiener–HopfmethodJ.Acoust.Soc.Am.159,5300–5308(2026)J....	张俊pcb	2026-07-06 02:41
文献求助	Correlation of Copper Pattern Surface Morphology and ... YasutakaAmitani;ShunsukeArima;KeisukeJokoCorrelationofCopperPatternSurfaceMorphologyandInsertionLossforHigh-SpeedCommunication2026IEEE76...	张俊pcb	2026-07-03 07:17
文献求助	Broadband Characterization of Newly Developed ABF Type A ... MahinAhamed;LakshmiNarasimhaVijayKumar;MadhavanSwaminathan;HabibHichri;YoshioNishimura;...	张俊pcb	2026-07-03 07:53
文献求助	Temperature-Dependent Electrical Characterization of New ABF... MahinAhamed;LakshmiNarasimhaVijayKumar;MadhavanSwaminathan;HabibHichri;YoshioNishimura;TakashiYamanakaTemperature-DependentElectricalCharacterizationofNewABF-TypeAMaterialUpto...	张俊pcb	2026-07-03 07:41
文献求助	Design and Signal Integrity Analysis of PCIe 5.0 SFF-8639(U.... ByeongmokKim;EunjiSeo;JihunKim;JunhoPark;JiwonYoon;JaegeunBaeDesignandSignalIntegrityAnalysisofPCIe5.0SFF-8639(U.2)ConnectorforAIDataServers2026IEEE76...	张俊pcb	2026-06-28 05:35
文献求助	3D Interconnection Using TGVs on Glass Interposer for ... SuinChae;SeonwooKim;YubinKim;JaemyungLim;JeinYu3DInterconnectionUsingTGVsonGlassInterposerforVertical32GbpsHigh-SpeedTransmission2026IEEE76...	张俊pcb	2026-06-28 05:32
文献求助	Design of UCIe-A x64 Chiplets Integration for 16-36 GT/s ... Sheng-FanYang;Liang-KaiChen;Wei-ChiaoWang;Ming-HungWu;Chih-ChiangHung;Wen-YiJianDesignofUCIe-Ax64ChipletsIntegrationfor16-36GT/sUsingOrganicInterposer2026IEEE76...	张俊pcb	2026-06-28 05:07
文献求助	Electrical Design Guidance of Chiplet Interface Channels to ... JiwoonMoon;JonghyeonLee;YuchulJung;YejiKim;KyunghoPark;YoungwooKimElectricalDesignGuidanceofChipletInterfaceChannelstoAchieve2634GB/s/mmDieEdgeBandwidth2026IEEE76...	张俊pcb	2026-06-27 02:50
文献求助	High-Bandwidth UCIe 2.0 Routing on Fine-Line Organic RDL ... AmitKumar;JiteshShah;NandakumarR.High-BandwidthUCIe2.0RoutingonFine-LineOrganicRDLwithEnhancedSignalandPowerIntegrityforScalable64-BitMulti-ChipletIntegration2026IEEE76...	张俊pcb	2026-06-27 02:39
文献求助	Design and Optimization of 2-mm Staggered RDL Interposer ... HongSeokKim;YoungeunNa;YeonJiShin;SooJeongKim;JinsikKim;WoojinLeeDesignandOptimizationof2-mmStaggeredRDLInterposerChannelsforUCIe3.0upto64GT/s2026IEEE76...	张俊pcb	2026-06-27 02:28
文献求助	Signal and Power Integrity Co-Analysis of Chiplet(UCIe)-... SignalandPowerIntegrityCo-AnalysisofChiplet(UCIe)-basedGPU-HBMInterconnectforReducedPHYAreaHaeseokSuh;JiwonYoon;YoungsuYoon;JunhoPark;HyunjunAn;JunghyunLee2026IEEE76...	张俊pcb	2026-06-26 09:56
文献求助	Advanced SI/PI Interposer Design Solution Enabling High-... AdvancedSI/PIInterposerDesignSolutionEnablingHigh-PerformanceHBM4eatupto12GbpsTaeyunKim;SungwookMoon;SeungkiNam;KyoungseokOh2026IEEE76...	张俊pcb	2026-06-26 09:11
文献求助	Temperature and Yield-Aware Design of UCIe Die-to-Die ... RamKrishna;AshitaVictor;ZhonghaoZhang;AtomWatanabe;XuChen;MuhannadS.BakirTemperatureandYield-AwareDesignofUCIeDie-to-DieInterconnectsforAdvancedPackaging2026IEEE76...	张俊pcb	2026-06-26 08:59
找工作	西湖大学工学院薄膜电子实验室科研助理及博后招聘（2）?熟练使用电路仿真、原理图设计、PCB设计等相关软件。具备良好的硬件调试能力，动手能力强。（3）具备微弱信号采样、放大、量化和预处理方法等相关电路设计经验或具有阵列式传感器...	bonn	2026-06-25 11:35
休闲灌水	国产实验室化学试剂品牌推荐 3.西陇试剂(XilongScientific)西陇试剂是国内率先上市的化学试剂公司，主营通用化学试剂、PCB用化学试剂、超净高纯化学试剂等，“有料网”是西陇科学旗下自营的电商平台，平台在售的产品...	qwerty8848	2026-06-25 06:51
文献求助	Signal and Power Integrity of Organic,Silicon,and Hybrid ... Ming-HungWu;YaotsuChen;Yi-ChinTsai;Po-YuanWei;Liang-KaiChen;ChungHsuanWuSignalandPowerIntegrityofOrganic,Silicon,andHybridInterposerinHPCChiplet-BasedSystem2026IEEE76...	张俊pcb	2026-06-24 09:50
文献求助	Figures of Merit to Characterize the Signal Integrity ... TaeilBae;JinwonLee;HyunggonBae;HyunsikKim;InchulJeong;HyungsooKimFiguresofMerittoCharacterizetheSignalIntegrityPerformanceofInterposerInterconnectforHighBandwidthMemory(HBM)...	张俊pcb	2026-06-24 09:15
文献求助	Signal,Power,and Thermal Integrity Co-Design for AI ... Ming-HungWu;Chun-HongChen;EricLin;Chi-LouYeh;Sheng-FanYangSignal,Power,andThermalIntegrityCo-DesignforAIAcceleratorASICandHBM3onSiliconInterposer2.5D-ICChipletIntegration2025...	张俊pcb	2026-06-24 09:18
文献求助	Marvell custom HBM routing and signal integrity analysis JoshuaF.Dillon;TingZhengMarvellTechnology,Inc.,SantaClara,CA,USA;ArshiyaVohra;KazinBlacklow;EricTremble;WolfgangSauterMarvellcustomHBMroutingandsignalintegrityanalysis2026IEEE...	张俊pcb	2026-06-23 11:43
文献求助	Chiplet Package for Automotive and Edge Processors TrentUehling;EliTiffin;StanCejka;NikhitaBaladari;GauravSharmaChipletPackageforAutomotiveandEdgeProcessors2025IEEE75thElectronicComponentsandTechnologyConference(ECTC)27-30May...	张俊pcb	2026-06-23 11:41
文献求助	EM and Channel Simulations of BoW-Based Structures for ... TengizSvimonishvili;MihaiD.Rotaru;RajuMani;RahulDuttaEMandChannelSimulationsofBoW-BasedStructuresforAdvancedPackagingTechnologies2024IEEE26...	张俊pcb	2026-06-23 11:18
文献求助	Furthering Moore’s Law Integration Benefits in the Chiplet ... RobMunozAllAuthorsFurtheringMoore’sLawIntegrationBenefitsintheChipletEraIEEEDesign&Test(Volume:41,Issue:1,February2024)IEEEDesign&Test(Volume:41,Issue:1,February2024)Page(s):...	张俊pcb	2026-06-17 08:03
博后之家	中国科学院苏州生物医学工程技术研究所磁共振方法学/电子类博士... 技能要求精通模拟/数字电路设计、PCB绘制、硬件调试，熟练使用示波器、信号源、频谱仪等测试仪器；掌握电磁场仿真、线圈设计、射频电路、功率电子、嵌入式开发（FPGA/MCU/ARM）任一方向者...	jjxyth	2026-06-14 06:01